Disk Drive Suspension Circuit Member With Side Pad Insulation
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Solution Overview
Problem
The existing methods for connecting conductors in disk drive suspensions face challenges in achieving reliable connections due to the thinness of conductors, which results in insufficient connection areas and risks of electrical short-circuits from solder adherence to metal support substrates.
Innovation Solution
A circuit member design featuring a side pad with a large connection area, comprising a metal base, insulating layer, conductor, and cover layer, where the side pad extends along the conductor's side surface, providing a thick portion for increased connection reliability and preventing solder adherence to the metal base through an insulating portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductor thickness is increased to provide sufficient connection area, then the connection reliability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent introduces a side pad structure that extends in the thickness direction (vertical dimension) rather than increasing conductor width (horizontal dimension). This allows the connection area to be expanded vertically along the conductor side surface, providing sufficient bonding area without increasing the horizontal footprint and avoiding the complexity of thicker conductors.
2Strength
If solder bonding is used to connect terminals, then the connection strength is improved, but the risk of electrical short-circuit increases due to solder adherence to metal base
Solution Approach 1:
The patent introduces an insulating layer positioned between the metal base and the side pad. This insulating layer acts as a mediator that prevents direct contact between the conductive solder and the metal base, eliminating the risk of solder bridge formation while still allowing the solder to bond to the insulating layer for strong electrical connection.
3Adaptability or versatility
If the number of conductors is increased to achieve multifunctionality, then the adaptability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the connection structure into distinct functional components: the conductor for electrical connection, the side pad for bonding area expansion, and the insulating layer for electrical isolation. This segmentation allows each component to be optimized independently, reducing the overall manufacturing precision requirements compared to a monolithic structure with multiple functions integrated.
Data Source
AI summary
A circuit member includes a metal base, an insulating layer, a conductor, and a cover layer. A terminal portion includes a thick portion formed on a side part of the insulating layer, and an extension portion, which is a part of the conductor, overlapping the thick portion. The extension portion includes a side pad portion along a side surface of the thick portion. A side surface of the side pad portion constitutes a side pad extending in a thickness direction of the conductor. A length of the side pad in a thickness direction is greater than a thickness of the conductor. A side pad insulating portion, which is formed of a part of the thick portion, is formed between a distal end of the metal base and the side pad portion.