Bond Pad Connector with Stress Relief for Stretchable Electronics
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Solution Overview
Problem
In wearable technology, surface mount devices (SMDs) embedded in electronic textiles face mechanical strains from movements like bending and stretching, leading to damage of interconnecting joints and reduced lifespan of smart clothing systems.
Innovation Solution
A bond pad connector with two spaced bond pads on a stretchable substrate, each connected to a conductive trace, featuring a stress relieve component with a central hole and an extension component to secure electronic components, reducing stress through deformation and distributing forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bond pads are used on stretchable substrates, then the electronic component can be secured, but the interconnecting joint is damaged due to mechanical strains from bending and stretching
Solution Approach 1:
The bond pad is divided into multiple functional segments: a first portion connected to the conductive trace, a second portion extending from the first, and a third portion extending from the second. This segmentation allows each portion to deform independently under mechanical strain, preventing damage to the interconnecting joint while maintaining electrical connection and securing the electronic component.
Solution Approach 2:
The bond pad structure is designed to be dynamic rather than rigid, with portions that can deform and move relative to each other under mechanical strain. The bond pad transitions from a static structure to a dynamic one that adapts to bending and stretching movements, absorbing mechanical energy and preventing joint damage.
2Strength
If the bond pad structure is made rigid to secure the electronic component, then the component is firmly attached, but the joint is vulnerable to mechanical strains from axial movements
Solution Approach 1:
Different portions of the bond pad have different structural characteristics optimized for their specific functions. The first portion is optimized for electrical connection to the conductive trace, the second portion for structural transition, and the third portion for securing the electronic component. Each local region has tailored properties that balance attachment strength with strain resistance.
Solution Approach 2:
The bond pad utilizes composite material structures combining rigid and flexible properties. The multi-portion design creates a composite structure where each portion can deform differently, combining the strength needed for component attachment with the flexibility needed to resist mechanical strains from axial movements.
3Reliability
If the bond pad is designed with multiple portions to withstand mechanical strains, then the lifespan is extended, but the device complexity increases
Solution Approach 1:
Multiple functional elements are merged into a single integrated bond pad structure. The first, second, and third portions are combined in one continuous structure that performs electrical connection, structural transition, and component securing functions simultaneously, reducing overall device complexity while maintaining reliability.
Solution Approach 2:
The bond pad structure serves multiple functions simultaneously: it provides electrical connection to the conductive trace, acts as a structural element that withstands mechanical strain, and secures the electronic component. This multi-functionality reduces the need for separate components, simplifying the overall device while extending lifespan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces stress on the bond pad connector and conductive traces, extending the lifespan of smart clothing systems by absorbing mechanical strains and maintaining a resilient joint under axial movements.
Implementation Method 1
The stress relieve component is adapted to be deformed to reduce stress on the bond pad connector
Implementation Method 2
the stress relieve component being formed with a central hole... adapted to be deformed to reduce stress
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A bond pad connector (100) to be disposed on a stretchable substrate to secure an electronic component thereon. The bond pad connector (100) includes two spaced apart bond pads (110) that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads (110) is adapted to be connected to a respective conductive trace (150) and includes: a stress relieve component (112) connected to the conductive trace (150), the stress relieve component (112) being formed with a central hole (114); and an extension component (116) extending from the stress relieve component (112) and opposite to the conductive trace (150). The electronic component is secured onto the bond pad connector (100) by attaching the electronic component to, for each of the bond pads (110), a part of the extension component (116).