Bonded Passive Component Structure for Low-Impedance Power Delivery
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Solution Overview
Problem
There is a challenge in efficiently incorporating passive electronic components like capacitors, resistors, and inductors into electronic systems due to space constraints on integrated device dies, packages, and system boards, which affects signal integrity and performance.
Innovation Solution
A bonded structure is developed where a semiconductor element is directly bonded to a passive electronic component without an intervening adhesive, allowing for a layered capacitor structure with high dielectric constant materials and optimized electrode configurations to reduce space occupancy and improve signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive electronic components are incorporated into electronic systems using conventional discrete mounting methods, then ease of manufacture and repair is improved, but space occupancy increases and signal integrity deteriorates
Solution Approach 1:
The patent merges the passive electronic component with the semiconductor element by directly bonding the passive component to the semiconductor element's surface, eliminating the need for separate mounting structures and reducing overall space occupancy while improving signal integrity through closer proximity
Solution Approach 2:
The patent transitions from planar mounting on the package substrate to vertical stacking in the third dimension, with the passive component bonded directly to the semiconductor element surface, thereby reducing footprint area while maintaining electrical connectivity
2Reliability
If passive electronic components are positioned farther from active components to simplify manufacturing, then ease of manufacture is improved, but inductance increases and signal integrity worsens
Solution Approach 1:
The passive electronic component serves dual purposes: it provides its primary electrical function while simultaneously acting as part of the interconnect structure, eliminating the need for separate bonding wires or traces and simplifying the overall manufacturing process
3Reliability
If adhesive layers are used to bond semiconductor elements to passive components, then ease of manufacture is improved, but inductance increases and signal integrity deteriorates
Solution Approach 1:
The patent extracts and eliminates the adhesive layer from the bonding interface between the semiconductor element and passive component, achieving direct bonding that reduces parasitic inductance and simplifies the structure while maintaining mechanical and electrical connectivity
Data Source
AI summary
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.