Multiple Fixed Capacitors TRIZ Cases
- Carbon Nanofiber Capacitor Structure for High-Density IC Packages
Vertical carbon nanofiber capacitors in package substrates raise capacitance density while lowering ESR, power loss, and internal heating.
- Heat Sink Plate Shielding for Capacitor-Noise Isolation
A metallic heat sink plate placed between the capacitor and circuit board blocks electromagnetic noise, prevents malfunctions, and improves cooling.
- Stacked Passive Semiconductor Structure With TSVs for ESD and Footprint Limits
Multiple passive tiers linked by TSVs add ESD protection, adjustable thickness, and higher capacitance or inductance in the same footprint.
- Capacitor Module Layout for Low-Height Noise Absorption
Placing Y capacitors and the ground bus bar within the PN region cuts capacitor module height while preserving noise absorption and smoothing.
- 3D Glass-Ceramic Capacitor Structures With Anisotropic Etching
Photosensitive glass-ceramic processing forms high-aspect-ratio 3D capacitor textures with lower cost, better yield, and higher capacitance.
- Converter Busbar Rail Layout for Low-Inductance Power Switching
A transverse busbar rail layout cuts stray inductance, shields high-frequency fields, and improves cooling around converter power units.
- Multilayer Ceramic Capacitor Corner Electrodes for Smaller Mounting Area
Triangular-pyramid corner electrodes let multilayer ceramic capacitors pack multiple unit capacitors into less board area while avoiding shorts.
- Capacitor Busbar Overhang Structure for Interference-Free Assembly
Elastic connecting protrusions clear the insertion path between busbars, improving capacitor element assembly and soldering quality.