Bonding Apparatus Thermal Control for Substrate Bending
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Solution Overview
Problem
The existing bonding methods face challenges in accurately aligning and bonding substrates due to thermal expansion differences, leading to bending issues in substrates with resin layers, which affects bonding precision.
Innovation Solution
A bonding method and apparatus that includes a heating unit to reduce substrate bending before bonding, and a cooling unit that controls temperature differences to manage bending during cooling, ensuring precise alignment and bonding of substrates with resin layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are heated to reduce bending before bonding, then bonding precision is improved, but thermal expansion differences cause bending issues in substrates with resin layers
Solution Approach 1:
The substrate is heated in advance before bonding to pre-reduce bending issues. By performing the heating treatment prior to the bonding process, the substrate reaches a more stable thermal state, which helps minimize bending during the subsequent bonding operation, thereby improving bonding precision.
Solution Approach 2:
The temperature parameter is changed and controlled during the heating process. By adjusting the heating temperature and duration, the substrate's thermal state is optimized to reduce bending while accounting for thermal expansion differences between materials, particularly in substrates containing resin layers.
2Productivity
If the combined substrate is cooled uniformly, then cooling efficiency is improved, but bending control is compromised
Solution Approach 1:
Instead of uniform cooling, the cooling process applies different cooling rates to different regions of the combined substrate. By creating localized temperature differences during cooling, the substrate's bending is controlled and managed, as different regions contract at different rates, compensating for thermal expansion variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves bonding precision by reducing substrate bending and controlling thermal expansion effects, resulting in enhanced alignment and bonding quality.
Implementation Method 1
thermal expansion differences, leading to bending issues in substrates with resin layers
Implementation Method 2
cooling the heated combined substrate by using a cooling unit. In the cooling, bending of the combined substrate is controlled by forming a temperature difference in the combined substrate
Data Source
AI summary
A bonding method includes attracting and holding a first substrate by using a first holder; attracting and holding a second substrate by using a second holder; and forming a combined substrate by moving the first holder and the second holder relative to each other to bring the first substrate and the second substrate into contact with each other. The bonding method includes heating the first substrate and the second substrate or the combined substrate; and cooling the heated combined substrate by using a cooling unit. In the cooling, bending of the combined substrate is controlled by forming a temperature difference in the combined substrate.