Temporary Bonding Composition for Fast Cure and UV Laser Release
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Solution Overview
Problem
Conventional compositions for temporary bonding in electronic device manufacturing are inadequate in curing rate, suitability for spin coating, heat resistance, low outgas properties under high temperature vacuum, and release rate, particularly in UV laser release processes.
Innovation Solution
A composition comprising a monofunctional (meth)acrylate with a specific alkyl group side chain, a polyfunctional (meth)acrylate, a polyisobutene copolymer, and a photo radical polymerization initiator, optionally with a UV absorber, which provides excellent curing rate, heat resistance, and low outgas properties, suitable for mechanical and UV laser release processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesives are used for temporary bonding, then bonding strength is sufficient, but curing rate is slow and heat resistance is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific photopolymerizable compounds (acrylates, vinyl ethers) and catalytic systems that enable rapid curing through light irradiation, while maintaining heat resistance through controlled polymerization and crosslinking mechanisms
Solution Approach 2:
The patent creates a composite adhesive system combining organic resin components with inorganic fillers and catalytic agents, achieving both rapid light-induced curing and high-temperature stability through synergistic material interactions
2Ease of manufacture
If conventional adhesives are used for temporary bonding, then bonding strength is sufficient, but suitability for spin coating is poor
Solution Approach 1:
The patent adjusts viscosity parameters and molecular weight distribution of the adhesive components to optimize spin-coating performance, achieving uniform thin films while maintaining adequate bonding strength through controlled polymer architecture
3Productivity
If conventional adhesives are used for temporary bonding, then bonding strength is sufficient, but release rate is slow particularly in UV laser release processes
Solution Approach 1:
The patent creates a dynamic adhesive system where bonding strength can be modulated through light irradiation, allowing the adhesive to transition from a strong bonded state during processing to a weakened release state through photodegradation or phototransition mechanisms
Solution Approach 2:
The patent employs periodic light irradiation cycles: first irradiation for curing and bonding, then subsequent irradiation for release, creating temporal separation between bonding and release functions through controlled photoreactions
4Ease of operation
If light-absorbing substance adhesive is irradiated with high intensity light for release, then release is achieved, but expensive apparatus such as laser is required and processing time is long
Solution Approach 1:
The patent replaces complex high-intensity laser systems with simpler UV-LED or fluorescent lamp systems by designing an adhesive composition that responds to lower-intensity, longer-wavelength light through efficient photoinitiator systems and light-absorbing chromophores
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves rapid curing, high heat resistance, low outgas properties, and efficient release, making it suitable for various electronic device manufacturing processes, including high-temperature steps and UV laser release.
Implementation Method 1
a photo radical polymerization initiator
Implementation Method 2
optionally with a UV absorber
Data Source
AI summary
A composition for temporary bonding, comprising: (A) a (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of -100°C to 60°C, and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.