Bonding Process Control via Real-Time Deformation Monitoring
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Solution Overview
Problem
Conventional automated high-speed bonding processes exhibit significant variability in geometric parameters of deformed bond members, leading to a broad distribution of values that often fall outside acceptable limits, compromising the structural integrity and performance of microelectronic components.
Innovation Solution
A process control procedure that monitors instantaneous deformation and time values during the bonding process, setting a shut-down time based on predetermined deformation and actuator time limits to constrain the deformation distribution, ensuring consistent production of deformed bond members with geometric parameters within acceptable tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional automated high-speed bonding processes are used, then productivity is improved, but manufacturing precision deteriorates due to significant variability in geometric parameters
Solution Approach 1:
The patent implements real-time monitoring of deformation values during the bonding process and uses this feedback to dynamically adjust process parameters. The system measures actual deformation of the bond member and compares it against target values, then adjusts bonding energy or time to compensate for variations, thereby maintaining geometric precision while preserving high productivity
Solution Approach 2:
The patent dynamically changes process parameters (bonding energy, time, force) based on real-time deformation measurements. By adjusting these parameters during the bonding process rather than using fixed conventional parameters, the system achieves consistent geometric outcomes across high-volume production
2Device complexity
If fixed bonding time is used, then device complexity is reduced, but manufacturing precision deteriorates due to broad distribution of geometric parameters
Solution Approach 1:
The system incorporates real-time deformation monitoring that provides feedback to the control system. This feedback enables dynamic adjustment of bonding parameters based on actual process conditions, achieving geometric consistency without requiring overly complex predetermined control schedules
Solution Approach 2:
The patent transitions from static fixed-time bonding to dynamic time-adjustment bonding. The bonding duration or energy application is dynamically modified based on real-time deformation measurements, allowing the process to adapt to variations in material properties while maintaining geometric precision
3Manufacturing precision
If higher bonding energy is applied, then manufacturing precision may be improved through greater deformation control, but object-generated harmful factors increase due to potential damage to bond members
Solution Approach 1:
The real-time deformation monitoring system provides feedback that prevents excessive bonding energy application. When the measured deformation approaches the target value, the system automatically reduces or stops energy application, thereby achieving precise deformation control without causing damage from over-bonding
Solution Approach 2:
The patent applies bonding energy in a controlled manner, potentially using slightly more than the minimum required energy but with real-time termination based on deformation measurements. This ensures sufficient deformation for precision while preventing harmful excessive action that would damage the bond member
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach narrows the distribution of geometric parameters, reducing the number of unacceptable final products and enhancing the structural integrity and performance of ball bonds, stitch bonds, ball bumps, and tab bonds by logically constraining the bonding process.
Implementation Method 1
transmitting bonding energy to the free air ball from a cooperative ultrasonic transducer
Implementation Method 2
The tool applies a downward compression force to press the free air ball against the pad
Data Source
AI summary
A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.