Bonding Device Curved Supporter for Display Panel Alignment

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Solution Overview

Problem

Existing bonding devices face challenges in adjusting and controlling the horizontal level of the side surface of a display panel, leading to inconsistent bonding quality and increased defects in display devices.

Innovation Solution

A bonding device with a stage and supporter configuration that allows for precise adjustment of the horizontal level, featuring a bonding head that can apply heat, pressure, and ultrasonic waves, and a clamp system to ensure parallel alignment with the bonding head, enabling uniform bonding across the side surface of the display panel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a driver is bonded to a side surface of a display panel by a bonding device, then the bonding process can be performed, but it is difficult to adjust or control the horizontal level of the side surface of the display panel

Engineering Contradiction:
Improvehorizontal level controlVSAvoidbonding device structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies curvature by designing the supporter with a recess portion having a first radius of curvature and the first support surface with a curved surface having a second radius of curvature. These curved surfaces work together to enable precise adjustment of the horizontal level of the display panel side surface, allowing the bonding device to achieve parallel alignment with the bonding head while maintaining a manageable device structure.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If the side surface of the display panel is not parallel to the bonding head, then the bonding process cannot be performed uniformly, but adjusting the horizontal level increases device complexity

Engineering Contradiction:
Improvebonding qualityVSAvoidstage and supporter structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The curved surfaces with specific radii of curvature in the stage and supporter enable precise horizontal level adjustment, ensuring the display panel side surface becomes parallel to the bonding head. This curvature-based design allows for reliable uniform bonding while keeping the structural complexity manageable through geometric optimization.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent changes geometric parameters by designing specific radius of curvature values for the recess portion and curved surface. By optimizing these curvature parameters, the device achieves the ability to adjust horizontal level precisely, ensuring parallel alignment between the display panel side surface and bonding head, thereby improving bonding quality without excessive structural complexity.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If the horizontal level of the side surface cannot be controlled, then bonding defects increase, but adding adjustment mechanisms increases device complexity

Engineering Contradiction:
Improvebonding process uniformityVSAvoidbonding device configuration
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The curved surfaces with optimized radii of curvature provide an elegant solution for controlling horizontal level. This geometric approach enables uniform bonding process by ensuring proper parallel alignment, while avoiding the need for complex mechanical adjustment mechanisms, thus maintaining ease of manufacture with reasonable device complexity.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for improved bonding quality by ensuring the side surface of the display panel is parallel to the bonding head, reducing defects and enhancing the uniformity of the bonding process.

Implementation Method 1

The bonding head may be configured to apply a heat and a pressure to a target object

Methodology Applied
Scientific EffectHeat: Heating

Implementation Method 2

The bonding head may be configured to apply a heat and a pressure to a target object

Methodology Applied
Scientific EffectPressure: Compression

Implementation Method 3

The bonding head may be configured to apply an ultrasonic wave to a target object

Methodology Applied
Scientific EffectUltrasonic wave: Ultrasonic Vibration

Implementation Method 4

The bonding head may be configured to irradiate a laser beam to a target object

Methodology Applied
Scientific EffectLaser beam: Laser

Data Source

PatentUS11528807B2Bonding device
Publication Date: 2022.12.13 SAMSUNG DISPLAY CO LTD
  • US11528807B2 patent drawing
  • US11528807B2 patent drawing
  • US11528807B2 patent drawing

AI summary

A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.