Printed Circuit Assembling TRIZ Cases

Segmented single-layer boards pass through openings to enable draw soldering, preventing empty joints and lowering manufacturing costs.

Attaching an IC to a MEM substrate before mounting a permanent magnet protects components from magnetic damage while enabling reliable field detection.

Flexible tamper sensor wraps enclosures to detect intrusion via resistance changes, preventing unauthorized access.

Segmented plug connector pins resolve assembly difficulty while maintaining electric characteristics via elastic deformation.

Fuses electronic components directly into three-dimensional objects during additive manufacturing passes.

An integrated controller chip processes image data to stabilize UAV imaging while managing flight dynamics.

Nesting an inductor inside a second electronic element cavity reduces the overall size of the power supply module while maintaining electrical connectivity.

Channel obstructions contain adhesive within a substrate cavity, eliminating epoxy air bubbles and enabling compact high-isolation designs.

Laser ablation forms trenches in copper traces to contain solder, eliminating organic resist outgassing and ensuring vacuum safety.

A vacuum solder pallet creates a sealed cavity with differential pressure to remove air pockets during reflow.

Modified epoxy resins lower the dielectric constant and dissipation factor of solder masks, enabling high-speed signal transmission on printed circuit boards.

Purge ports apply fluid pressure to counteract top die warpage and prevent interconnect stretching during reflow.

Crossing first and second column pads reduce the non-display area while preventing electrical shorts between panel lines.

A circuit board via structure uses conductive composite resin between metal layers and glass substrates to maintain electrical conduction.

A positioning block on a circuit board inserts into a flexible board hole to align pins, preserving the rigid board's internal routing area.

Fast cure non-conductive epoxy enables rapid substrate attachment without thermal damage to sensitive components.

A module assembly device with side walls and protrusions supports photo-detector array tiles during concurrent reflow soldering operations.

Segmented heating tools apply uniform pressure to cure resin between flexible substrate electrodes, eliminating non-uniform joins from large pressing surfaces.

Insulating resin fills gaps between substrates to prevent conductive member penetration, eliminating short circuits and cracks at step portions.

Segmented printed circuit boards connect via flexible interconnects, reducing manufacturing complexity and cost.

An inclined pressing area on a holding jig adapts to thermal warping in ceramic circuit boards, ensuring reliable contact parts bonding.

Segmented plating fills through holes reliably while enabling 30 μm narrow wiring.

Segmented rigid regions on a flexible paddle card accommodate manufacturing variabilities, preventing connector damage during motherboard installation.

A reflow soldering device uses vacuum control to remove gas inclusions from liquid solder.

Injection molded plastic substrates with coupling means allow selective metallization for diverse applications, reducing production costs.

A planar optical interface module uses perpendicularly mounted ferrules and a light rotation mechanism to transfer signals between fibers and detectors.

Bonding a multi-layer PCB between a power device and cold plate resolves manufacturing complexity while maintaining high component density.

Grooves segment conductive coatings to prevent uneven solder flow and preserve surface flatness.

Planar interconnects eliminate wirebonds and multi-layer substrates, reducing parasitic inductance and package height.

A wiring board cavity exposes a plane layer with a peripheral recess to anchor electronic components securely.

Local pad-relative coordinates resolve global skew and tolerance errors by redefining positions from fixed contact pads rather than a global origin.

Segmented plating creates thick via sidewalls for high current capacity without increasing outer layer thickness.

A flexible circuit connector with conductors in openings automates battery pack assembly.

Wire bond spacing replaces laser drilling to extend frequency range beyond 3.5 mm wavelengths.

Silver paste bonding material with triol addition agent prevents film cracking and void formation during electronic part assembly.

A nonwoven glass fabric epoxy resin substrate matches the thermal expansion coefficient of a build-up wiring layer to prevent wrinkles during manufacturing.

Mounts capacitor array sections in parallel or series configurations to eliminate differential-mode and common-mode noise.

Segmented adhesive layers resolve the contradiction between strong thermal adhesion and easy reworkability in circuit assemblies.

Integrates connector with integrated circuit chip to reduce material consumption and production costs while maintaining miniaturization.

Solder-infused thermosetting resin cures to adhere components, increasing tin density in gold bumps to suppress Kirkendall void formation.

Spaced solder pads distribute stress to prevent offset and tombstoning in miniaturized electronic components.

Thermal conductivity adhesive fills gaps between embedded electronic components and multilayer wiring boards, preventing damage during miniaturization.

Rear-mounted receptacle adapters with self-aligning features reduce enclosure depth by fully inserting Mini-SAS HD connectors.

Curved stage and supporter surfaces adjust the horizontal level of the display panel side surface, ensuring parallel alignment with the bonding head.

Rotating squeegee holder automates blade detachment, eliminating manual screw removal to reduce operator workload during exchange.

Single flexible printed circuit board integrates opto-electronic transducers and electrical connectors for compact optical interface modules.

A semiconductor module housing creates a fluid flow gap via a protective wall to carry away ultrasonic welding particles, preventing insulation contamination.

Double shielding structure blocks electromagnetic waves without increasing device weight.

A matrix-based batch fabrication process packages multiple circuit component dice on a copper substrate using horizontal and vertical conductor plates.