Matrix Batch Fabrication of High-Power Circuit Components
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Solution Overview
Problem
Existing packaging technologies for high-power circuit components, such as power diodes and transistors, face challenges in achieving efficient and cost-effective fabrication with high current capacity and heat dissipation, due to stringent precision requirements in dimensioning and alignment, leading to elevated production costs and quality issues.
Innovation Solution
A matrix-based batch fabrication process that involves forming preparative electrical terminals on a copper substrate, pick-and-placing circuit component dice with electrodes, and using horizontal and vertical conductor plates with openings for soldering, followed by thermal reflow to secure the components, allowing for larger processing tolerances and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If two large conductive copper plates are used for matrix-based packaging, then productivity is improved through simultaneous packaging of multiple circuit component dice, but manufacturing precision deteriorates due to stringent tolerance requirements in dimensioning, alignment, and thickness control
Solution Approach 1:
The invention divides the packaging structure into modular units, where each circuit component die is packaged individually within its own encapsulating material and lead frame assembly. This segmentation allows each module to be manufactured and assembled independently, reducing the cumulative tolerance accumulation that would occur in a monolithic matrix packaging approach.
Solution Approach 2:
The invention transitions from a planar two-dimensional matrix packaging approach to a three-dimensional structure by vertically stacking the circuit component die, encapsulating material, and lead frame assemblies. This dimensional change allows for better tolerance management by distributing alignment requirements across multiple planes rather than requiring perfect planar alignment across the entire matrix.
2Manufacturing precision
If stringent precision control is implemented for copper plate dimensioning and alignment, then manufacturing precision is improved, but productivity deteriorates due to elevated cost levels and poor production yield rate
Solution Approach 1:
The invention performs preliminary actions by pre-attaching the circuit component die to the lead frame assembly and pre-forming the encapsulating material around each individual module before final assembly. This preliminary preparation of modular units simplifies the final assembly process and reduces the precision requirements during the actual packaging operation, thereby improving production yield rate.
Solution Approach 2:
The invention changes the packaging parameters by adopting a modular assembly approach with standardized lead frame dimensions and encapsulating material thicknesses. This standardization allows for easier quality control and reduces the stringency of tolerance requirements, enabling higher production volumes with acceptable yield rates.
3Ease of manufacture
If existing packaging technology is used for high-power components, then ease of manufacture is improved through availability of standard packages, but heat dissipation deteriorates due to thermal management bottlenecks
Solution Approach 1:
The invention introduces an intermediary thermal management structure between the high-power circuit component die and the external environment. The lead frame assembly serves as a thermal intermediary, conducting heat away from the die through its metallic construction, while the encapsulating material provides thermal pathways to external heat sinks. This intermediary structure enables effective heat dissipation while maintaining ease of manufacture through standardized assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enables efficient and cost-effective fabrication of high-power circuit components with improved heat dissipation and current capacity, reducing production costs and enhancing production yield rates while accommodating larger dimensional discrepancies.
Implementation Method 1
a thermal reflow is performed to simultaneously melts a soldering material pre-applied to the surface of each preparative electrical terminal of the copper substrate, the surface of the top electrode of the die, and the vertical conductive surface of the opening in the horizontal conductor plate
Implementation Method 2
each die electrode is electrically connected to a corresponding electrical terminal of the circuit component it is packaged in
Data Source
AI summary
A process for batch fabrication of circuit components is disclosed via simultaneously packaging multiple circuit component dice in a matrix. Each die has electrodes on its tops and bottom surfaces to be electrically connected to a corresponding electrical terminal of the circuit component it's packaged in. For each circuit component in the matrix, the process forms preparative electrical terminals on a copper substrate. Component dice are pick-and-placed onto the copper substrate with their bottom electrodes landing on corresponding preparative electrical terminal. Horizontal conductor plates are then placed horizontally on top of the circuit component dice, with bottom surface at one end of each plate landing on the dice's top electrode. An opening is formed at the opposite end and has vertical conductive surfaces. A vertical conductor block is placed into the opening and lands on the preparative electrical terminal, and the opening's vertical conductive surfaces facing the top end side surface of the vertical block. A thermal reflow then simultaneously melts pre-applied soldering material so that each circuit component die and its vertical conductor block are soldered to the copper substrate below and its horizontal conductor plate above.