Wire Bond Waveguides for High-Frequency Signal Routing
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Solution Overview
Problem
Conventional substrate-integrated waveguides (SIWs) are limited by laser drilling spacings, which restrict their application to frequencies with wavelengths greater than 3.5 mm, and photolithographic semiconductor processing is costly for narrower spacings.
Innovation Solution
The use of spaced-apart wire bond wires to form a signal guide circuit structure, allowing for higher frequency applications without the high cost of photolithographic semiconductor processing, and enabling surface routing not possible with conventional SIWs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling is used to form metal posts for substrate-integrated waveguides, then manufacturing cost is reduced, but metal post spacing is limited to minimum 350 microns which restricts application to frequencies with wavelengths greater than 3.5 mm
Solution Approach 1:
The patent replaces the mechanical laser drilling process with wire bonding technology to form the waveguide structure. Wire bonding enables sub-350 micron spacing between conductive elements while maintaining compatibility with existing PCB manufacturing processes, thereby extending frequency application range without requiring expensive photolithographic semiconductor processing
Solution Approach 2:
The invention changes the key parameter from metal post spacing (limited by laser drilling to 350 microns) to wire bond spacing (achievable at sub-350 micron pitches). This parameter change enables the waveguide to support higher frequency applications with wavelengths less than 3.5 mm while using cost-effective wire bonding technology
2Adaptability or versatility
If photolithographic semiconductor processing is used to form metal posts with sub-350 micron pitches, then frequency application range is extended, but manufacturing cost increases substantially
Solution Approach 1:
The patent substitutes expensive photolithographic semiconductor processing with wire bonding technology. Wire bonding achieves sub-350 micron spacing required for high-frequency applications while using established, cost-effective PCB manufacturing processes, thereby extending frequency range without substantially increasing manufacturing cost
Solution Approach 2:
The invention uses wire bonds as temporary or disposable conductive elements that can be easily formed and removed if needed, replacing the need for expensive permanent photolithographic metal post structures. This approach provides high-frequency capability at lower cost by using simpler, more flexible bonding technology
Data Source
AI summary
Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.