Power Supply Module Integrating Connector with IC Chip
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Solution Overview
Problem
The traditional method of integrating power supply modules is complex, leading to increased material usage, production costs, and waste due to multiple circuit design iterations and the need for external port electrodes.
Innovation Solution
A power supply module is designed with a coil, electronic components, and a magnetic conductor, where the connector is integrally formed with the integrated circuit chip, reducing the need for external connections and encapsulating the components with magnetic powder to form a compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are electrically connected together in advance and encapsulated by resin to form an integrated structure, then the power supply module achieves integration and miniaturization, but the production process becomes more complicated and material consumption increases
Solution Approach 1:
The connector is integrally formed with the integrated circuit chip, merging two previously separate components (connector and IC chip) into a single integrated structure. This eliminates the need for separate connector assembly steps and reduces the number of external connections required, thereby simplifying the production process while maintaining miniaturization benefits
Solution Approach 2:
The integrated circuit chip serves multiple functions: it acts as both the functional electronic component and the structural base for the connector. This multi-functionality reduces the number of separate components needed, simplifying the overall production process while achieving integration
2Reliability
If multiple circuit design iterations are performed for lead frame and component integration, then the power supply module achieves proper electrical connections, but production costs increase and material waste occurs
Solution Approach 1:
The connector is pre-integrated with the integrated circuit chip during the chip manufacturing process itself, rather than being added as a separate component later. This preliminary action ensures proper electrical connections are established from the outset, eliminating the need for multiple design iterations and reducing material waste from failed assemblies or rework
3Ease of operation
If external port electrodes are provided on the printed circuit board for user connections, then the power supply module achieves proper external connectivity, but material consumption increases and production costs rise
Solution Approach 1:
The connector functions serve are merged into the integrated circuit chip itself, eliminating the need for separate external port electrodes on the printed circuit board. The IC chip package provides the external connection interface directly, reducing material consumption while maintaining ease of operation for user connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production process, reduces material consumption, lowers production costs, and enhances electromagnetic interference protection and heat transfer.
Implementation Method 1
a magnetic conductor, configured to enclose in and around the coil body and the electronic component
Implementation Method 2
enhances electromagnetic interference protection and heat transfer
Data Source
AI summary
A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.