Embedded Component Circuit Board Thermal Adhesive
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Solution Overview
Problem
The miniaturization of circuit boards leads to increased component embedding, which results in components being easily damaged during the embedding process, necessitating a more robust manufacturing method.
Innovation Solution
A method for manufacturing a circuit board with an embedded electronic component involves creating a multilayer wiring board with gradually increasing openings and a receiving cavity, using a protective film and conductive via to secure the component, and filling the gap with a thermal conductivity adhesive to prevent damage and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board size is reduced to achieve miniaturization, then the compactness and portability of electronic products are improved, but the components become more susceptible to damage during embedding
Solution Approach 1:
The method performs preliminary actions by forming protective films on components before embedding, pre-defining receiving cavities with precise dimensions, and preparing adhesive layers in advance. These preliminary preparations ensure components are protected and properly positioned before the actual embedding process, reducing damage risk in miniaturized boards
Solution Approach 2:
The patent applies beforehand cushioning by forming protective films around components prior to embedding and using adhesive layers to cushion components during the embedding process. This protective cushioning prevents direct mechanical stress and damage to components during embedding in miniaturized circuit boards
2Productivity
If more components are embedded in smaller circuit boards, then the functionality and integration density are improved, but the risk of component damage increases
Solution Approach 1:
The method segments the embedding process into distinct steps: forming protective films on individual components, defining separate receiving cavities for each component, and applying adhesive layers selectively. This segmentation allows precise control over each component's embedding process, maintaining high integration density while reducing damage risk through individualized protection
Solution Approach 2:
The patent introduces intermediary elements including protective films as mediators between components and embedding stress, adhesive layers as mediators between components and circuit board, and receiving cavities as mediators that control component positioning. These intermediaries protect components during high-density embedding
3Ease of manufacture
If conventional embedding methods are used, then the manufacturing process is simple, but components are easily damaged and stability is poor
Solution Approach 1:
The method merges multiple functions into integrated steps: protective films serve both as protection during embedding and as part of the final component structure, receiving cavities simultaneously guide component positioning and provide mechanical support, and adhesive layers both bond components and cushion them during embedding. This merging maintains manufacturing efficiency while improving reliability
Solution Approach 2:
The patent applies parameter changes by controlling the thickness and material properties of protective films, adjusting the dimensions and shape of receiving cavities, and optimizing the viscosity and curing characteristics of adhesive layers. These parameter optimizations ensure component protection and stability without significantly complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the risk of component damage and instability, while improving heat dissipation by using a thermal conductivity adhesive, ensuring reliable and efficient embedding of electronic components on circuit boards.
Implementation Method 1
an adhesive with a thermal conductivity is used to fill the gap between the electronic component and the wiring board, thereby preventing the electronic component from being damaged due to instability in addition to improving heat dissipation
Data Source
AI summary
A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.