Insulating Resin Gap Sealing for Electrode Connection Reliability
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Solution Overview
Problem
Conventional transfer connecting structures in liquid crystal display devices, particularly in TN systems, face issues of short circuit failures and conduction failures due to the penetration of electrically conductive members into gaps between substrates and the generation of cracks at step portions, which can lead to insulation failures.
Innovation Solution
A connecting structure where the second substrate is smaller than the first, with electrodes arranged around the periphery, and an insulating resin is applied to cover side surfaces and fill gaps between substrates, preventing the electrically conductive member from penetrating and ensuring proper wetting and spreading, thus avoiding short circuits and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrically conductive member is used to connect electrodes on upper and lower substrates, then electrical connection is achieved, but the conductive member may penetrate into gaps between substrates causing short circuit failures
Solution Approach 1:
The patent divides the connection structure into distinct functional zones: a first region for electrical connection and a second region for sealing/insulation. The insulating resin is applied to seal the peripheral gap between substrates, creating a clear separation between the conductive member placement area and the gap area, thus preventing penetration-induced short circuits while maintaining connection reliability
Solution Approach 2:
The insulating resin acts as an intermediary substance between the electrically conductive member and the gap between substrates. It provides both mechanical support to hold the conductive member in place and electrical insulation to prevent short circuits, resolving the contradiction between achieving electrical connection and preventing harmful penetration
2Reliability
If the electrically conductive member is applied at step portions between substrates, then connection is formed, but cracks may generate leading to conduction failures
Solution Approach 1:
The insulating resin is applied in advance to cover the step portions and peripheral gaps between substrates before the electrically conductive member is applied. This preliminary sealing action creates a smooth, continuous surface that eliminates the step portions where cracks would otherwise generate, ensuring the conductive member maintains its integrity without cracking
Solution Approach 2:
The insulating resin provides beforehand cushioning by filling and sealing the step portions and gaps before the conductive member is placed. This cushioning effect prevents stress concentration at the step edges during curing or thermal processing, thereby preventing crack generation and maintaining conductive member strength
3Ease of manufacture
If substrates are glued together with gaps between them, then assembly is achieved, but gaps allow conductive member penetration causing insulation failures
Solution Approach 1:
The patent segments the substrate assembly into a central active area with liquid crystal layer and a peripheral sealing area. The insulating resin is applied specifically in the peripheral region to seal gaps, while the central area maintains the necessary assembly structure for electrical connection, thus achieving both ease of manufacture and insulation reliability
Solution Approach 2:
The insulating resin serves as an intermediary sealing layer that fills the gaps between glued substrates without interfering with the main assembly process. It provides mechanical filling of gaps and electrical insulation, allowing the substrates to be easily assembled while preventing harmful penetration that would compromise insulation reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents short circuit failures and conduction failures by sealing gaps with insulating resin and ensuring the electrically conductive member spreads correctly, enhancing the reliability of the connection between electrodes.
Implementation Method 1
an insulating resin is arranged near said first electrodes so as to cover portions of the side surfaces of said second substrate and to fill the gap between said first substrate and said second substrate
Implementation Method 2
said electrically conductive member arranged over regions leading from said first electrodes through the upper surface of the insulating resin to said second electrodes
Data Source
AI summary
Providing a connecting structure for connecting first electrodes formed on the upper surface of a first substrate to second electrodes formed on the upper surface of a second substrate glued on the upper surface of the first substrate by an electrically conductive member, wherein the second substrate is smaller in its outer size than the first substrate, the first electrodes are arranged on the first substrate around the periphery of the second substrate, a gap is formed between the first and second substrates at the peripheral edge of the second substrate, an insulating resin is arranged near the first electrodes so as to cover portions of the side surfaces of the second substrate and to fill the gap between the first and second substrates, and the electrically conductive member is arranged over regions leading from the first electrodes through the insulating resin to the second electrodes.