Integrated MEM Magnetometer Package with Spacer Structure

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current magnetic field measurement apparatuses are often bulky, expensive, and high-power consuming, and face challenges in detecting small changes over large ranges due to separate manufacturing and assembly of MEM magnetometers and integrated circuits.

Innovation Solution

An integrated magnetometer package is formed by attaching an integrated circuit to one side of a MEM magnetometer substrate and creating a spacer structure on the opposite side with an opening for a movable part, allowing a permanent magnet to be mounted later, avoiding damage from magnetic forces and enabling testing without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If MEM magnetometer and integrated circuit are manufactured separately and assembled, then manufacturing flexibility is maintained, but device complexity and assembly difficulty increase

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidassembly difficulty
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines the MEM magnetometer substrate and integrated circuit into a single integrated magnetometer package. The integrated circuit is attached directly to the MEM magnetometer substrate, merging two separately manufactured components into one unified device. This reduces assembly complexity while maintaining the manufacturing flexibility of separate fabrication processes.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If permanent magnet is mounted before integrated circuit attachment, then magnetic field sensing is enabled, but MEM magnetometer components are damaged by magnetic forces

Engineering Contradiction:
Improvemagnetic field sensing capabilityVSAvoiddamage from magnetic forces
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The integrated circuit is attached to the MEM magnetometer substrate before mounting the permanent magnet. This preliminary action of attaching the circuit board protects the MEM magnetometer components from the harmful magnetic forces that will be present when the permanent magnet is mounted, while still enabling magnetic field sensing capability in the final assembled device.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If permanent magnet is mounted early in assembly, then magnetic field detection is enabled, but testing and assembly are interfered with by magnetic forces

Engineering Contradiction:
Improveassembly efficiencyVSAvoidtesting capability
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The device is assembled and tested without the permanent magnet initially mounted. The integrated circuit is attached and the device is tested for proper operation before the permanent magnet is finally mounted. This preliminary assembly and testing approach eliminates magnetic interference during critical testing phases while maintaining productivity in the final assembly step.

Inventive Principle:
Principle #10Preliminary action

4Object-affected harmful factors

If integrated magnetometer package is formed with later magnet mounting, then component protection is achieved, but manufacturing process complexity increases

Engineering Contradiction:
Improvecomponent protection from magnetic damageVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The integrated magnetometer package is formed with the integrated circuit attached to the MEM magnetometer substrate before the permanent magnet is mounted. This preliminary formation of the package structure protects the sensitive MEM components from magnetic damage during assembly, while the additional manufacturing step is offset by the protection it provides to expensive components.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a compact, cost-effective, low-power consumption apparatus capable of detecting small magnetic field changes over large ranges without damaging the MEM magnetometer components during assembly.

Implementation Method 1

mounting a permanent magnet through the opening to the movable part

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Data Source

PatentUS8159218B2Microelectromechanical magnetometer with integrated electronics
Publication Date: 2012.04.17 ALCATEL LUCENT SA
  • US8159218B2 patent drawing
  • US8159218B2 patent drawing
  • US8159218B2 patent drawing

AI summary

A method of manufacturing an apparatus 200 comprising forming an integrated magnetometer package 202. Forming an integrated magnetometer package 202 includes forming a movable part 215 from a MEM magnetometer substrate 210, and attaching an integrated circuit 910 to one side 212 of the MEM magnetometer substrate. A spacer structure 410 is formed on an opposite side of the MEM magnetometer substrate such that the moveable part is exposed through an opening 420 in the spacer structure. But the moveable part cannot escape through said opening. A permanent magnet 1010 is mounted through the opening to the movable part.