Electronic Device Module Double Shielding EMI
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Solution Overview
Problem
There is a demand for miniaturized and lightweight electronic devices that require effective shielding against electromagnetic interference (EMI) to enhance their performance and reliability, particularly in portable devices where space and weight are critical.
Innovation Solution
An electronic device module is designed with a ground electrode, a sealing portion, a shielding wall, and a conductive shielding layer formed from different materials, which provides a double shielding structure to effectively shield electromagnetic waves while minimizing the module's size and weight. The shielding layer is strategically placed along the side surface of the sealing portion and connected to the ground electrode, with a thickness variation to optimize shielding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is added to protect electronic components from EMI, then EMI shielding performance is improved, but device size and weight increase
Solution Approach 1:
The patent employs thin film shielding structures including conductive shielding films deposited on internal surfaces of the package cavity, and thin sealing portions made of elastomeric materials that provide both sealing and EMI shielding functions. These thin film approaches achieve effective EMI shielding without adding significant weight to the device.
Solution Approach 2:
The sealing portion serves multiple functions simultaneously: it seals the package cavity to protect electronic components from environmental factors, provides EMI shielding through its conductive or elastomeric material properties, and structurally supports the mounted electronic devices. This multi-functionality reduces the need for separate shielding components, thereby minimizing weight increase.
2Object-affected harmful factors
If a shielding structure is added to protect electronic components from EMI, then EMI shielding performance is improved, but device volume increases
Solution Approach 1:
The patent utilizes thin film shielding structures deposited on the internal surfaces of the package cavity, requiring minimal additional space. The shielding films are applied as thin coatings rather than bulk materials, achieving effective EMI shielding with minimal volume increase.
Solution Approach 2:
The shielding structures are nested within the existing package cavity space. The conductive shielding films are deposited on internal surfaces, and the sealing portion with EMI shielding properties is integrated into the package structure itself, effectively utilizing available space without requiring additional external volume.
3Object-affected harmful factors
If multiple shielding components are used to achieve effective EMI shielding, then EMI shielding performance is improved, but device complexity increases
Solution Approach 1:
The sealing portion is designed to perform multiple functions: environmental sealing, EMI shielding, and structural support for mounted devices. By integrating these functions into a single component rather than using separate shielding elements, the overall device complexity is reduced while maintaining effective EMI shielding performance.
Solution Approach 2:
The patent merges the sealing function and EMI shielding function into a single integrated sealing portion. The sealing portion is made of elastomeric material that inherently provides EMI shielding, eliminating the need for separate shielding components and simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves excellent EMI shielding, protecting electronic components from external environments and ensuring reliable operation while maintaining the compactness and lightness required for portable devices.
Implementation Method 1
a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall
Data Source
AI summary
An electronic device module may include: a board; a ground electrode disposed on a first surface of the board; a sealing portion disposed on the first surface of the board; electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion; a first shielding wall connected to the ground electrode and disposed along a side surface of the sealing portion; and a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall.