Integrated Power Electronics Embedded PCB Cold Plate Assembly

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Solution Overview

Problem

The design and manufacture of multi-layer printed circuit boards (PCBs) and their electrical communication with power devices are challenging, particularly in creating highly integrated power electronics embedded PCBs that require effective thermal management.

Innovation Solution

A method involving bonding a cold plate substrate to a power device-substrate assembly, 3D printing a multi-layer PCB onto the assembly, and attaching a cold plate manifold to form a thermal communication system with mechanical fasteners for enhanced heat transfer and structural reinforcement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multi-layer PCBs are used to increase component density and capacity, then the electrical connection capacity is improved, but the design and manufacture complexity increases

Engineering Contradiction:

Improvecomponent densityVSAvoidmanufacture complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent combines the PCB substrate, power device, and cold plate into a single integrated assembly. The PCB is bonded directly to the power device substrate, and the cold plate is bonded to the PCB, creating a unified structure that reduces manufacturing steps and complexity while maintaining high component density

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The PCB serves multiple functions simultaneously: it provides electrical connections between components, acts as a structural support substrate, and serves as a thermal management interface for the cold plate attachment, thereby reducing the need for separate components and simplifying the overall assembly

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Quantity of substance

If power devices are integrated into multi-layer PCBs to increase capacity, then the electrical connection capacity is improved, but the thermal management difficulty increases

Engineering Contradiction:

Improveelectronic component capacityVSAvoidthermal management

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The patent merges the thermal management function directly into the PCB assembly by bonding the cold plate to the PCB substrate. This integration ensures that heat from the power devices is efficiently conducted through the PCB to the cold plate, maintaining effective thermal management as component capacity increases

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The PCB substrate acts as an intermediary thermal pathway between the power devices and the cold plate. It conducts heat away from the power devices and transfers it to the cold plate, enabling effective thermal management in high-density configurations

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If cold plate manifold is bonded to multi-layer PCB to improve thermal communication, then the heat transfer efficiency is improved, but the structural integrity reinforcement is needed

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidstructural integrity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

Mechanical fasteners are installed through the PCB and cold plate manifold assembly before final bonding operations. This preliminary action reinforces the structural integrity of the assembly, ensuring that the thermal management components remain securely positioned and the structure can withstand subsequent manufacturing and operational stresses

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of highly integrated power electronics embedded PCBs with efficient thermal management, maintaining power device temperatures below predefined levels through fluid cooling and reinforcing the structural integrity of the cold plate manifold.

Implementation Method 1

bonding a cold plate substrate onto a first side of a power device—substrate assembly, bonding a multi-layer PCB onto a second side of the power device—substrate assembly, and bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate in thermal communication with the power device—substrate assembly

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240341027A1Highly integrated power electronics and methods of manufacturing the same

Publication Date: 2024.10.10 TOYOTA MOTOR ENG & MFG NORTH AMERICA INC

AI summary

A method of fabricating or manufacturing a highly integrated power electronics (IPEs) embedded printed circuit board (PCB)—cold plate assembly includes bonding a cold plate substrate onto a first side of a power device—substrate assembly, bonding a multi-layer PCB onto a second side of the power device—substrate assembly, and bonding a cold plate manifold onto the multi-layer PCB and forming a cold plate in thermal communication a power device of the power device—substrate assembly. The multi-layer PCB can be 3D printed onto the second side of the power device—substrate assembly and bonding of the cold plate manifold to the multi-layer PCB can be reinforced with mechanical fasteners.