Modular Printed Circuit Board With Injection Molded Coupling Means
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Solution Overview
Problem
Existing printed circuit boards are inflexible and costly due to their tailor-made designs for specific applications, making them difficult to adapt for different uses, such as rear view devices in motor vehicles, where various dimensions and components are required, leading to increased production costs and inefficiencies.
Innovation Solution
A method of manufacturing printed circuit boards using injection molding to create substrate parts with integrated coupling and receiving means, structural elements, and heat sinks, allowing for modular assembly and flexible circuit design, including the use of laser direct structuring for circuit application, which enables efficient production and adaptation for diverse applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If printed circuit boards are designed with tailor-made electric circuits for specific applications, then the mounting place design becomes compact and optimized, but the boards become difficult to adapt for other applications and require multiple different board types
Solution Approach 1:
The printed circuit board is divided into a modular substrate structure that can be selectively metallized in different patterns. The substrate itself is a reusable base that can accommodate various circuit layouts through selective metallization processes, allowing the same physical substrate to serve multiple application purposes while maintaining compact mounting designs.
Solution Approach 2:
The invention applies selective metallization techniques that change the electrical parameters of the substrate by depositing conductive materials only in specific areas. This allows the same substrate to be configured with different circuit patterns for different applications, transforming a fixed-design board into an adaptable platform through controlled material deposition.
2Manufacturing precision
If multiple printed circuit boards are manufactured for various applications, then each application has its optimized board, but the production cost increases
Solution Approach 1:
The invention creates a universal substrate platform that can serve multiple applications through selective metallization. Instead of manufacturing entirely different boards for each application, the same substrate type can be configured for different uses by controlling where conductive materials are deposited, thereby reducing the number of unique board designs needed and lowering production costs while maintaining application-specific optimization.
3Reliability
If identical assemblies require various printed circuit boards with different dimensions, then the assemblies can be properly controlled, but the cost efficiency decreases
Solution Approach 1:
The invention introduces dynamic configurability to the circuit board through selective metallization. The substrate can be adapted to different dimensional and circuit requirements for identical assemblies by controlling the metallization pattern, allowing the same base substrate to be dynamically configured for different assembly types, thereby maintaining reliable assembly control while improving cost efficiency through reduced substrate variety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances mechanical stability, and expands the versatility of printed circuit boards, allowing for easy assembly and reliable connections, while also providing efficient heat dissipation and flexibility in design to accommodate various applications.
Implementation Method 1
Laser direct structuring techniques enable the application of circuits in the desired layout on three-dimensional substrates
Implementation Method 2
manufacturing a plurality of plastic substrate parts in an injection molding process
Implementation Method 3
a first substrate part is connected to at least a second substrate part through the at least one coupling means and the at least one receiving means
Data Source
AI summary
A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.