Ceramic Sensor Groove Limits Solder Wetting
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Solution Overview
Problem
Existing methods for soldering connections on ceramic sensors with conductive coatings result in uncontrollable solder flow, leading to unevenness and reduced surface area availability, which hinders miniaturization and proper sensor installation due to excessive solder application and surface irregularities.
Innovation Solution
A method involving a groove surrounding the connection point on the ceramic base body, which limits solder wetting and provides a visual positioning aid, allowing precise solder application and reducing the required solder amount, thereby maintaining surface flatness for other uses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large quantity of soft solder is applied to ensure sufficient solder at the connection point, then the soldering quality is improved, but the solder spreads uncontrollably over the coating surface causing unevenness and reducing available surface area
Solution Approach 1:
The coating surface is segmented into a connection area and a non-connection area by the groove structure. The groove physically divides the surface, confining solder to the connection area while preserving the non-connection area for other uses such as mounting surfaces or holes.
Solution Approach 2:
The groove creates local quality differentiation on the coating surface. The connection area has wettable properties for solder, while the non-connection area remains non-wettable or is physically separated, allowing different functional requirements to be met in different zones.
2Quantity of substance
If soft solder is applied in large quantity to compensate for flow during soldering, then sufficient solder is available at the connection point, but the solder solidifies in the entire wetted area causing surface unevenness
Solution Approach 1:
The groove segments the wetting area, confining solder flow to a limited zone. This allows sufficient solder quantity to be applied without spreading to the entire surface, thereby maintaining surface flatness in non-connection areas.
Solution Approach 2:
The groove acts as an intermediary barrier that controls solder flow. It mediates between the applied solder and the coating surface, directing solder to the connection point while preventing unwanted spread that would cause unevenness.
3Area of stationary object
If the coating is interrupted or a non-wettable layer is applied to limit solder wetting, then surface area availability is improved, but an additional operation or coating interruption is required
Solution Approach 1:
The groove is created in the base body before the conductive coating is applied. This preliminary action establishes the physical barrier that will later confine solder, eliminating the need for additional non-wettable coating layers or mask interruptions during the coating process.
Solution Approach 2:
The groove structure combines multiple functions: it serves as a mechanical barrier to limit solder wetting, a visual positioning aid for connection points, and preserves surface area for other uses. This integration eliminates the need for separate non-wettable coating operations.
4Reliability
If connection elements are soldered onto the coating, then electrical connections are established, but the solder flow affects areas outside the connection location hindering miniaturization
Solution Approach 1:
The groove segments the working area, allowing miniaturization by confining soldering operations to small connection zones. This enables higher component density and miniaturization while maintaining reliable electrical connections within the confined connection areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove effectively restricts solder spread, ensuring sufficient solder at the connection point while keeping other areas available for sensor installation and miniaturization, reducing solder usage and enhancing surface usability.
Implementation Method 1
the groove 7 spatially delimits the wetting of the coating 3 with soft solder 9 that takes place during the soft soldering process
Implementation Method 2
a first electrically conductive, soft-solderable coating (39) is applied to the outer insulating surface of the base body (13), which encloses a connection location (41) provided for contacting the first connection (31)
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Method for soldering a connection element to a connection point on an electrically conductive coating that is suitable for soft-soldering on an insulating surface of a base body using a soft-soldering method; as well as sensors manufactured using this method for which a spatial limitation of the wetting of the coating with soft-solder material, during the process of soft-soldering, is effected by providing a groove in the base body which at least partly surrounds the connection point on the outside. At least a part of the area of the external insulating surface of the base body including the connection point is coated with the coating, and soft-solder material is locally applied to the connection point and the connection element is soldered onto the connection point using the applied soft-solder material in a soft-soldering process.