Power Supply Module 3D Stacked Inductor Package
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Solution Overview
Problem
Conventional electronic package structures have low spatial utilization and large sizes due to the surface disposition of electronic elements, leading to inefficient use of internal space.
Innovation Solution
The electronic package structure incorporates a second electronic element with a cavity to house the first electronic elements and a lead frame, allowing for higher internal space utilization by either disposing the first elements within the cavity or stacking the second element on the first, thereby reducing the overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic elements are disposed on the surface of the PCB or circuit substrate, then the electrical connection and assembly process is simplified, but the spatial utilization is low and the overall size is large
Solution Approach 1:
The patent places the first electronic element inside the cavity of the second electronic element, creating a nested configuration. The cavity of the second element serves as a housing for the first element, thereby utilizing the internal space of the package structure and reducing the overall volume while maintaining electrical connectivity through the lead frame.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting arrangement to a three-dimensional configuration by utilizing the vertical dimension. The first electronic element is positioned inside the cavity of the second element, effectively using the depth dimension to increase spatial utilization without increasing the footprint area.
2Device complexity
If electronic elements are disposed on the surface of the PCB or circuit substrate, then the electrical connection is simplified, but the overall size of the package structure is large
Solution Approach 1:
The first electronic element is nested within the cavity of the second electronic element, reducing the horizontal spread of the package. The lead frame extends vertically to provide electrical connections, thereby reducing the overall package length and width while maintaining the necessary electrical connectivity functionality.
Solution Approach 2:
The patent reconfigures the electrical connection architecture from a planar surface-mounted arrangement to a three-dimensional structure where connections are established through the vertical dimension via the lead frame, reducing the horizontal footprint of the package.
Data Source
AI summary
A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.