Circuit Assembly with Segmented Adhesive for Reworkable Thermal Management
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Solution Overview
Problem
The existing configuration of overlapping a circuit board and a heat dissipating member via an insulating layer makes it difficult to perform rework, such as peeling the adhesive layer to replace components, due to the adherence of wiring for electrical connections and heat dissipation across the entire adhesive layer.
Innovation Solution
A circuit assembly is designed with an insulating film between the circuit board and the heat dissipating member, featuring an air layer in regions without the insulating film, and using adhesive or sticky heat conductors to maintain insulation and facilitate reworking, while reducing the amount of thermally conductive material needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is used to bond the circuit board and heat dissipating member across the entire overlapping region, then strong adhesion and thermal conduction are achieved, but rework becomes difficult due to complete adherence of all components
Solution Approach 1:
The adhesive layer is segmented into two distinct types: a first adhesive layer in the heat dissipation region providing strong adhesion and thermal conduction, and a second adhesive layer in the non-heat dissipation region providing releaseability for rework. This segmentation allows different functional requirements to be met in different spatial zones without compromising overall performance.
Solution Approach 2:
Different adhesive properties are applied to different regions: the first adhesive layer has high adhesion strength and thermal conductivity for the heat dissipation region, while the second adhesive layer has low adhesion strength and releaseability for the non-heat dissipation region. This local differentiation resolves the contradiction between needing strong bonding and enabling easy rework.
2Temperature
If thermally conductive adhesive is applied across the entire overlapping region, then heat dissipation is maximized, but the amount of material increases and cost rises
Solution Approach 1:
The thermally conductive adhesive is extracted from the entire overlapping region and concentrated only in the heat dissipation region where it is actually needed. The non-heat dissipation region uses a different adhesive without the same thermal conduction properties, thereby reducing the total quantity of thermally conductive material while maintaining heat dissipation efficiency.
Solution Approach 2:
Instead of applying thermally conductive adhesive across the entire overlapping region (excessive action), the patent applies it only to the necessary heat dissipation region (partial action), optimizing material usage while achieving the required thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for easier reworking while maintaining electrical insulation and heat dissipation, securely fixing the components, and reducing manufacturing costs by minimizing the use of thermally conductive materials.
Implementation Method 1
an air layer is formed between the circuit board and the heat dissipating member in a region in which the insulating film is not arranged
Implementation Method 2
it is possible to maintain insulation between the circuit board and the heat dissipating member by a region arranged with a layer of air and a region arranged with the insulating film
Implementation Method 3
an adhesive or sticky first heat conductor that is arranged between the circuit board and the insulating film and is in contact with the circuit board and the insulating film, and an adhesive or sticky second heat conductor that is arranged between the insulating film and the heat dissipating member
Data Source
AI summary
A circuit assembly that includes a heat generator; a circuit board, which has a conduction path, and to which the heat generator is mounted, a heat dissipating member arranged facing the circuit board, an insulating film arranged in a region that is overlapped by the heat generator between the circuit board and the heat dissipating member, an adhesive or sticky first heat conductor that is arranged between the circuit board and the insulating film and is in contact with the circuit board and the insulating film, and an adhesive or sticky second heat conductor that is arranged between the insulating film and the heat dissipating member and is in contact with the insulating film and the heat dissipating member.