Laser-Ablated Solder Stop for High-Temperature Vacuum Modules
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Solution Overview
Problem
Solder resist materials used in the printed circuit board industry are not suitable for high temperature processes, as they can burn, discolor, flake, and outgas, contaminating vacuum oven environments and causing issues in high voltage assemblies with gel encapsulation.
Innovation Solution
A method utilizing laser ablation to remove plated surfaces and oxidize the underlying metal, creating trenches that act as a solder stop to prevent solder flow, which are temperature-resistant, non-outgassing, and safe in vacuum environments, eliminating the need for custom tooling and reducing processing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder resist is used to prevent solder overflow, then solder containment is improved, but manufacturing complexity and processing time increase due to additional manufacturing steps
Solution Approach 1:
The patent removes the separate solder resist layer entirely and instead creates solder containment features directly within the copper trace structure itself. The copper trace is formed with integrated barrier sections that contain solder without requiring an additional solder resist material layer, thus eliminating the complexity of applying, patterning, and curing separate solder resist while maintaining reliable solder containment.
Solution Approach 2:
The patent combines the functions of the copper trace (electrical conduction) and the solder barrier (solder containment) into a single integrated structure. The copper trace includes built-in barrier sections that simultaneously serve as electrical pathways and solder containment features, merging what were previously separate functions into one unified component.
2Reliability
If solder resist is applied to prevent solder overflow, then solder containment is improved, but processing time and manufacturing cost increase
Solution Approach 1:
The patent eliminates the time-consuming steps of applying, drying, and curing separate solder resist materials by removing this entire subsystem. Instead, solder containment is achieved through the geometric design of the copper trace itself, which requires no additional processing steps beyond standard copper trace formation.
Solution Approach 2:
The copper trace is designed with built-in barrier sections during the initial trace formation process, before soldering occurs. These pre-integrated barrier features are formed as part of the copper trace fabrication, eliminating the need for subsequent solder resist application steps and reducing overall processing time.
3Strength
If high temperature soldering is performed, then strong solder bonds are achieved, but solder resist materials burn, discolor, flake, and outgas contaminating vacuum environments
Solution Approach 1:
The patent removes the vulnerable solder resist material layer that decomposes at high temperatures. By using the copper trace structure itself to provide solder containment, the system eliminates the source of outgassing and contamination, allowing high-temperature soldering to proceed without introducing harmful byproducts into vacuum environments.
Solution Approach 2:
The patent changes the material parameter from organic solder resist (which decomposes at high temperatures) to inorganic copper trace structures (which are thermally stable). This material substitution allows the system to withstand high-temperature soldering processes without burning, discoloring, flaking, or outgassing, thereby eliminating contamination in vacuum environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a stable, high-temperature solder stop that prevents solder overflow, maintains vacuum safety, and allows for precise control over solder placement, ensuring strong, conductive, and stable soldered bonds in power electronic modules.
Implementation Method 1
forming trenches on a portion of the first attach with a laser to form a solder stop
Implementation Method 2
a portion of a surface of the first component being oxidized
Data Source
AI summary
A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.