Segmented Heating Tool for Flexible Substrate Electrode Joining
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for connecting flexible substrates to other substrates using a heating tool with a large pressing surface result in non-uniform pressing and heating, leading to insecure electrode joins and insufficient resin reinforcement, reducing the reliability of the connection.
Innovation Solution
A method involving a heating tool with a smaller pressing surface that abuts and heats specific electrode pairs, using a bonding material with conductive particles and thermosetting resin, while moving the tool to apply consistent pressure and heat, ensuring uniform curing and joint strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a heating tool with a large pressing surface is used to join multiple electrodes simultaneously, then the joining process is efficient, but the pressing force and heating temperature become non-uniform across the connection region
Solution Approach 1:
The connection region is divided into multiple sub-regions, each corresponding to a pair of electrodes to be joined. The heating tool's pressing surface is segmented into multiple pressing portions, with each portion corresponding to a specific sub-region. This segmentation allows independent control of pressing force and heating temperature for each electrode pair, ensuring uniformity while maintaining efficient simultaneous joining of multiple electrodes.
2Productivity
If solder particles are added to the uncured resin for simultaneous solder-joining and resin reinforcement, then the process is integrated and efficient, but fine adjustments to pressing force and heating temperature are required
Solution Approach 1:
The heating tool is designed with multiple heating portions corresponding to different sub-regions of the connection region. Each heating portion can independently control heating temperature and duration for its corresponding sub-region. This local quality approach allows fine adjustments to be made at each location where solder particles are present, ensuring proper solder joining and resin reinforcement without requiring complex global control adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of substrate connections by maintaining consistent pressure and heat application, reducing voids in the resin reinforcement and improving joint strength, allowing for more efficient and reliable connections between flexible substrates and main circuit boards.
Implementation Method 1
heating the first electrodes and the second electrodes to a temperature at which the thermosetting resin cures
Implementation Method 2
an uncured resin supplied between the module substrate and the main circuit board is heated via the module substrate or main circuit board and cured, thereby to form a resin reinforcement portion comprising cured resin
Implementation Method 3
joining a plurality of electrodes on one substrate to a plurality of electrodes on another substrate with a conductor that is to be melted and then solidified
Data Source
AI summary
Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.