Vacuum Solder Pallet for Void-Free IC Reflow
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Solution Overview
Problem
The challenge in IC chip manufacturing is the formation of voids in soldered connections due to unwanted gases during the reflow process, which can lead to overheating issues, especially in high-power applications like automotive battery controllers, and existing vacuum systems are costly and not compatible with standard reflow ovens.
Innovation Solution
A vacuum solder pallet configured to engage a standard reflow oven conveyor, connected to a vacuum source for creating a differential pressure within a sealed cavity, allowing for continuous vacuum application during the soldering process to remove air pockets and voids, while using a standard reflow oven system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reflow oven is used to melt solder element, then soldering connection is formed, but unwanted gases are released causing voids in the connection
Solution Approach 1:
The patent applies vacuum (inert environment) during the reflow soldering process to remove unwanted gases released from the solder element and substrate. By creating a vacuum atmosphere in the reflow oven, gases are evacuated from the chamber, preventing them from forming voids in the soldered connection and improving connection reliability.
2Reliability
If a stand-alone vacuum system with three separate process chambers is used to remove voids, then void removal is achieved, but system cost and complexity increase significantly
Solution Approach 1:
The patent merges the vacuum function with the standard reflow oven by integrating a vacuum pump and sealing mechanisms directly into the existing reflow oven structure. This allows the reflow oven to simultaneously provide heating and vacuum functions, eliminating the need for separate vacuum chambers and reducing overall system complexity while maintaining void removal capability.
Solution Approach 2:
The reflow oven is designed to perform multiple functions: heating for solder melting and vacuum creation for gas removal. By making the reflow oven multi-functional, the system eliminates the need for dedicated vacuum equipment, reducing cost and complexity while achieving both soldering and void prevention in a single device.
3Manufacturing precision
If vacuum is applied during soldering process, then air pockets are removed from soldered joint, but additional equipment and process chambers are required
Solution Approach 1:
The vacuum system is integrated into the standard reflow oven structure, combining two processes (heating and vacuum application) into a single chamber. This eliminates the need for separate vacuum chambers and complex multi-chamber systems, making the manufacturing process simpler while achieving void-free soldered joints.
Solution Approach 2:
The reflow oven itself provides the vacuum function through integrated vacuum pumps and sealing mechanisms, making the system self-sufficient. The standard reflow oven performs both heating and vacuum creation without requiring external vacuum equipment, simplifying the manufacturing process and reducing equipment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes voids in soldered connections, ensuring reliable and void-free joints even in high-power applications, without the need for additional costly vacuum-specific ovens, by applying a continuous vacuum during the reflow process.
Implementation Method 1
A vacuum source may be selectively connected to at least one area of the vacuum solder pallet to provide a differential pressure within a sealed cavity within a portion of the vacuum solder pallet
Implementation Method 2
provide a differential pressure within a sealed cavity
Implementation Method 3
The application of heat is typically conducted in a reflow oven, which melts the solder without damaging the adjoining areas and the attached electrical components
Implementation Method 4
subjected to a controlled heat, which melts the soldering element, thereby forming a permanent electrical connection
Implementation Method 5
A plurality of thermocouples may be selectively connected to at least one area of the vacuum solder pallet to monitor at least one temperature associated with the vacuum solder pallet
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly (100). The pallet assembly (100) may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned (140) within the first atmosphere, and the solder element (140) may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.