Electronic Component Bonding Fillet for Thermal Stress Peeling
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Solution Overview
Problem
The peeling and damaging of the bonding material between the electronic component and the mounting portion due to heat stress caused by the difference in linear expansion coefficients leads to conductivity and heat-emission deterioration in electronic devices.
Innovation Solution
An electronic device design with a bonding material that includes a base portion and a fillet portion covering the ridges of the electronic component, and a manufacturing method involving application and curing of a paste-like bonding material to ensure comprehensive coverage of the component's corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding material is applied only to the mounting surface without extending to cover the ridges, then the application process is simple, but the bonding material peels off or gets damaged due to heat stress from linear expansion coefficient difference
Solution Approach 1:
The bonding material is extended from a two-dimensional layer on the mounting surface into a three-dimensional structure with a fillet portion that covers the ridges. This dimensional extension allows the bonding material to provide mechanical reinforcement and stress distribution across the ridge areas, preventing peeling and damage while maintaining structural integrity under thermal cycling conditions.
Solution Approach 2:
The bonding material is applied to extend beyond the mounting surface boundaries before the electronic component is mounted. This preliminary extension creates a protective fillet structure that anticipates and prevents future peeling or damage by already covering the vulnerable ridge areas, eliminating the need for additional protective structures.
2Reliability
If the bonding material is extended to cover the ridges forming a fillet portion, then peeling and damaging are suppressed, but the manufacturing precision requirement increases
Solution Approach 1:
The bonding material application parameters are optimized to achieve the desired fillet portion geometry. By controlling the paste viscosity, application pressure, and curing conditions, the bonding material naturally forms the required extended structure covering the ridges without requiring ultra-precise positioning, thus reducing manufacturing precision requirements while maintaining reliability.
3Productivity
If the paste-like bonding material is applied only to the central part of the mounting surface, then the application process is fast, but the corner portions are not adequately bonded leading to peeling
Solution Approach 1:
The bonding material is applied in a pattern that pre-extends toward the corner portions and ridge areas before the electronic component is placed. This preliminary action ensures that when the component is mounted, the bonding material already covers the vulnerable corner and ridge areas, preventing peeling while maintaining efficient application speed through a systematic application pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling and damaging of the bonding material, maintaining conductivity and heat-emission performance in the electronic device.
Implementation Method 1
a bonding material to bond the electronic component to the mounting portion
Implementation Method 2
a curing process of curing the paste-like bonding material and forming the bonding material
Data Source
AI summary
An electronic device which can suppress peeling off and damaging of the bonding material is provided. The electronic device includes an electronic component, a mounting portion, and a bonding material. The electronic component has an element front surface and an element back surface separated in the z-direction. The mounting portion has a mounting surface opposed to the element back surface on which the electronic component is mounted. The bonding material bonds the electronic component to the mounting portion. The bonding material includes a base portion and a fillet portion. The base portion is held between the electronic component and the mounting portion in the z-direction. The fillet portion is connected to the base portion and is formed outside the electronic component when seen in the z-direction. The electronic component includes two element lateral surface and ridges. The ridges are intersections of the two element lateral surface and extend in the z-direction. The fillet portion includes a ridge cover portion which covers at least a part of the ridges.