Bonding Head Thermal Management for Semiconductor Manufacturing
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges in achieving high precision and minimizing heat distortion, particularly in bonding processes for flip chip and through-silicon-via chips, where high accuracy and efficient cooling are crucial.
Innovation Solution
A semiconductor manufacturing apparatus and method that incorporates a pickup unit, a bonding head with a heater and cooling block, and an optical unit to detect bonding positions accurately, using a gantry frame for precise movement and alternating bonding heads for efficient heating and cooling, along with a cooling liquid system to enhance cooling efficiency and prevent heat distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a heater is used to bond the chip, then bonding precision is improved, but heat distortion increases
Solution Approach 1:
The patent employs a heater to raise the bonding head temperature to a specific range (e.g., 100-200°C) to achieve proper bonding precision, while simultaneously using a cooling block with cooling liquid to prevent excessive heat accumulation and distortion. This parameter control approach allows the system to operate at optimal temperature without suffering from heat distortion.
Solution Approach 2:
The cooling block acts as an intermediary thermal management component between the heater and the bonding head. It absorbs excess heat through cooling liquid circulation, mediating the thermal effects to maintain bonding precision while preventing heat distortion in the chip and surrounding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves bonding precision, reduces heat distortion, and enhances cooling efficiency, thereby increasing productivity and reducing costs by allowing for faster chip bonding and efficient reuse of cooling liquids.
Implementation Method 1
a bonding head including a heater for heating a chip and bonding the chip onto a circuit board
Implementation Method 2
a cooling block, adjacent to the heater, through which cooling liquid flows
Implementation Method 3
The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled
Data Source
AI summary
A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.