Semiconductor/Solid-State Device Testing/Measurement TRIZ Cases
- STI Step Height Offset Control for Implant Critical Dimensions
Measured STI step height offsets compensate photoresist exposure dosage to stabilize ion implant critical dimensions.
- Semiconductor Search Apparatus Parameter Space Optimization
A search apparatus generates a prediction model to identify promising parameter regions within vast semiconductor processing spaces.
- Interposer-Based Semiconductor Package Testing Method
A testing method uses an interposer with conductive elements on an adhesive layer to electrically test semiconductor chips directly.
- Semiconductor Module Breakage Detection via Resistor Monitoring
A semiconductor module uses a resistor and detector to monitor electrical changes for early breakage identification.
- 3D Crack Detection Structure in Semiconductor Devices
A three-dimensional crack detection structure surrounds a semiconductor die to identify defects across multiple vertical levels.
- Wire Bonding Automatic Rework for Non-Stick Conditions
Automated rework recovers from non-stick conditions through electrical continuity tests and re-bonding, reducing manual intervention and production delays.
- Substrate Rotator Edge Metrology for Defect Detection
A substrate rotator positions wafers for edge metrology stations to scan all sides.
- Semiconductor Inspection Patterns for Process Center Monitoring
Intentional defects in dummy area patterns reveal process center shifts before yield reduction occurs.
- X-ray Detector Array Substrate Test Patterns for Measurement Accuracy
Array substrate with separate test patterns for transistors and optical detectors.
- Segmented Alignment Marks for Semiconductor Stress Relief
Segmenting metal alignment marks into spaced sub-marks distributes dicing stress uniformly, preventing peeling and short circuits.
- Integrated Metrology and Process System for Semiconductor Film Control
An integrated metrology and process system links measurement tools directly to deposition equipment.
- Semiconductor Marking Dam Structure for Resin Protection
A dam structure isolates identification markings from dense device regions, preventing resin leakage and ensuring reliable code reading.
- OLED Panel Hydrochromic Encapsulation Defect Detection
Hydrochromic material in OLED encapsulation changes color upon water vapor contact, enabling precise defect detection without complex equipment.
- Fault Detection Assembly for IC Supply Disconnection
MOS-type fault detection assembly identifies supply or ground disconnection by monitoring input voltage levels, preventing unintended activation and damage.
- Wafer Edge Inspection via Area Segmentation
A substrate inspection method divides peripheral edge images into divided areas to acquire feature amounts for precise defect detection.