Semiconductor Module Breakage Detection via Resistor Monitoring

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Solution Overview

Problem

Conventional semiconductor modules face increased manufacturing costs due to the need for extra space and additional components for detecting breakages, such as dummy wires or resistors, which are costly and enlarge the module size.

Innovation Solution

A semiconductor module design that includes a semiconductor element, a circuit board with a resistor connected to its surface, and first wiring members directly linking the semiconductor element to the resistor, where a detector monitors changes in voltage drop or current values in the resistor to detect potential breakages without requiring extra space or additional components like dummy wires.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dummy wire is connected to the semiconductor element for breakage detection, then breakage detection capability is improved, but the area of the semiconductor element increases leading to higher manufacturing cost

Engineering Contradiction:
Improvebreakage detection capabilityVSAvoidsemiconductor element area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The detection function is extracted from the semiconductor element itself and implemented externally using a resistor and detector circuit. The semiconductor element only needs to connect to the resistor through the first wiring member, eliminating the need for dummy wires on the element surface.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The first wiring member serves dual purposes: it acts as both the current supply path from the semiconductor element and as the detection path through the resistor. This multi-functionality eliminates the need for separate dummy wires dedicated solely to detection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If two leading terminal electrodes are connected via a resistor for voltage measurement, then deterioration detection capability is improved, but the area of the semiconductor module increases leading to higher manufacturing cost

Engineering Contradiction:
Improvedeterioration detection capabilityVSAvoidsemiconductor module volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The detection circuit components (resistor and detector) are merged into the existing module structure rather than being added as separate external components. The resistor is positioned to be connected by the first wiring member within the module footprint, combining detection functionality with the power delivery path.

Inventive Principle:
Principle #5Merging (Combining)

3Loss of time

If a dummy wire with weaker joining strength is used for early breakage detection, then detection timing is improved, but the complexity of the wiring structure increases

Engineering Contradiction:
Improvedetection timingVSAvoidwiring structure complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The detection mechanism changes from monitoring physical wire breakage (dummy wire approach) to monitoring electrical parameter changes (voltage drop or current change) in the resistor. This allows detection of connection deterioration without requiring specially designed dummy wires with modified mechanical properties.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for early detection of semiconductor module breakages while maintaining a compact size and reducing manufacturing costs by eliminating the need for extra components, ensuring timely maintenance before complete failure.

Implementation Method 1

the detector detects at least one of a change of a voltage drop value in the resistor and a change of a current value in the resistor

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS10978364B2Semiconductor module
Publication Date: 2021.04.13 MITSUBISHI ELECTRIC CORP
  • US10978364B2 patent drawing
  • US10978364B2 patent drawing
  • US10978364B2 patent drawing

AI summary

A semiconductor module is obtained in which breakage of the semiconductor module can be detected in advance while suppressing increase in manufacturing cost. A semiconductor module includes a semiconductor element, a circuit board, a resistor, a first wiring member, and a detector. The circuit board includes a circuit pattern. The resistor is connected to a surface of the circuit pattern. The first wiring member directly connects the resistor to the semiconductor element. In the first wiring member, at least part of current flowing from the semiconductor element to the circuit pattern flows. The detector is configured to detect at least one of a change of a voltage drop value in the resistor and a change of a current value in the resistor.