Integrated Metrology and Process System for Semiconductor Film Control
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Solution Overview
Problem
The existing process for controlling semiconductor product quality is inefficient due to the distance between inspection and treatment stations, leading to increased cycle times and manual calculations for deposition and etching, which results in inconsistent process control.
Innovation Solution
An integrated system comprising a process apparatus, a metrology apparatus, and a transfer apparatus that allows for immediate adjacency and automatic communication between the metrology and process apparatuses, enabling real-time measurement and automated recipe selection for film treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inspection station is placed far from the process equipments, then the measurement can be performed separately, but the cycle time of checking, depositing, and etching the film increases
Solution Approach 1:
The patent merges the inspection station (metrology apparatus) with the process equipments (deposition and etching tools) into an integrated system. The metrology apparatus is positioned adjacent to both the deposition tool and etching tool, allowing substrates to be measured without being transported to a distant inspection station. This integration enables real-time film thickness measurement and immediate feedback for process adjustment, reducing cycle time while maintaining quality control.
2Adaptability or versatility
If manual calculation is used to determine deposition or etching time based on film information, then flexibility is maintained, but process control consistency deteriorates due to different users' experiences
Solution Approach 1:
The patent implements an automated feedback system where the metrology apparatus measures film thickness and transmits the data to a control system. The control system automatically calculates the required deposition or etching time based on the measured film information and pre-programmed parameters, then sends control signals to the respective process tools. This eliminates manual calculation variability while maintaining process flexibility through programmable parameters, ensuring consistent process control across different operators.
Solution Approach 2:
The patent replaces the manual mechanical process of calculating deposition/etching time with an automated electronic calculation system. The control system uses electronic computations based on measured film data and stored process parameters to determine exact processing times, substituting human judgment with consistent algorithmic processing. This maintains adaptability through programmable parameters while eliminating inconsistencies caused by different users' experiences.
Data Source
AI summary
An integrated system operation method is disclosed that includes the following steps: the film of a substrate is measured by a metrology apparatus to obtain a film information. The substrate is moved from the metrology apparatus to a process apparatus adjacent to the transfer apparatus. The film information is sent to the process apparatus. A film treatment is applied to the substrate in accordance with the film information.