3D Crack Detection Structure in Semiconductor Devices
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Solution Overview
Problem
Conventional semiconductor devices struggle to detect cracks effectively, particularly horizontal cracks that do not penetrate the top surface, leading to yield losses in defective products.
Innovation Solution
A semiconductor device with a three-dimensional crack detection structure formed in a ring shape in the peripheral region, extending vertically to surround the central region, which includes a conduction loop connecting multiple conduction layers to detect cracks of various types by applying test signals and comparing input and output signals for voltage drop or phase differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a two-dimensional crack detection structure is used, then the device complexity is low, but the measurement precision for detecting horizontal cracks is insufficient
Solution Approach 1:
The patent transitions from a two-dimensional crack detection structure to a three-dimensional structure by adding vertical extension through multiple conduction layers. This dimensional change enables detection of horizontal cracks that do not penetrate the top surface, directly resolving the measurement precision issue while accepting increased structural complexity
2Measurement precision
If a three-dimensional crack detection structure with multiple conduction layers is used, then the measurement precision for crack detection is improved, but the device complexity increases
Solution Approach 1:
The three-dimensional crack detection structure serves multiple detection functions simultaneously - it can detect both vertical cracks and horizontal cracks across different depths. The conduction loop spanning multiple conduction layers provides universal crack detection capability, justifying the increased complexity through enhanced functional versatility
Solution Approach 2:
The crack detection structure employs nested conduction layers where inner conduction loops are positioned within outer conduction loops across different vertical levels. This nested arrangement enables comprehensive crack detection at multiple depths while organizing the complex structure in a systematic, space-efficient manner
3Productivity
If conventional two-dimensional detection structures are used, then the manufacturing process is simple, but the productivity due to yield losses from undetected cracks is reduced
Solution Approach 1:
The three-dimensional crack detection structure performs preliminary detection of cracks during the manufacturing process itself, identifying defects before final product completion. By detecting horizontal cracks that conventional methods miss, it prevents yield losses from undetected defects, improving productivity despite increased manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances crack detection capabilities, reducing yield losses by thoroughly identifying cracks of all types, including those that conventional two-dimensional structures miss, thereby improving product quality.
Implementation Method 1
detect cracks of various types by applying test signals and comparing input and output signals for voltage drop or phase differences
Data Source
AI summary
A semiconductor device includes a semiconductor die, a semiconductor integrated circuit and a three-dimensional crack detection structure. The semiconductor die includes a central region and a peripheral region surrounding the central region. The semiconductor integrated circuit is formed in the central region. The three-dimensional crack detection structure is formed in a ring shape in the peripheral region to surround the central region. The three-dimensional crack detection structure is expanded in a vertical direction. Using the three-dimensional crack detection structure, the crack penetration of various types may be detected thoroughly.