Wire Bonding Automatic Rework for Non-Stick Conditions
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Solution Overview
Problem
Wire bonding operations often encounter non-stick conditions, such as free air balls not bonding sufficiently to pads or wires not bonding to leads, leading to delays and costly manual interventions due to contamination or material variations.
Innovation Solution
Implementing automatic rework processes in wire bonding machines that use electrical continuity tests to detect insufficient bonds and perform re-bonding operations, either at the same or offset areas, using the same or adjusted bonding parameters, to ensure reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection and intervention are used to handle non-stick conditions, then bond quality can be verified, but production delays increase and labor costs rise
Solution Approach 1:
The system performs self-inspection through automated electrical continuity testing and self-correction through re-bonding operations when non-stick conditions are detected, eliminating the need for manual operator intervention and maintaining continuous production flow
Solution Approach 2:
The system implements feedback control by continuously monitoring bond quality through electrical continuity tests and automatically adjusting the process by performing re-bonding operations when defects are detected, creating a closed-loop quality assurance system
2Productivity
If automated rework processes are implemented, then manual intervention is reduced, but device complexity increases
Solution Approach 1:
The bonding tool is designed to perform multiple functions including initial bonding, electrical continuity testing, and re-bonding operations, eliminating the need for separate inspection and correction equipment and reducing overall system complexity
Solution Approach 2:
The system merges the bonding and inspection processes into a single integrated operation, where the bonding tool simultaneously performs bonding and electrical continuity testing, and automatically re-bonds if defects are detected, consolidating multiple functions into one tool
3Reliability
If re-bonding is performed at the same bonding location, then bond reliability improves, but the bonding location may be compromised due to contamination
Solution Approach 1:
The system applies different re-bonding strategies based on local conditions: re-bonding at the same location when the area is clean, or offset re-bonding when contamination is detected, optimizing bond reliability while accounting for local contamination conditions
Solution Approach 2:
The re-bonding location is dynamically selected based on real-time assessment of the bonding area condition, allowing the system to adapt between same-location and offset re-bonding to maintain bond quality while avoiding contaminated areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Substantially reduces the need for manual operator intervention by automatically recovering from non-stick errors, ensuring consistent and reliable wire bonding operations, and minimizing production delays.
Implementation Method 1
performing a test to determine if the portion of wire is sufficiently bonded to the bonding location
Implementation Method 2
varying types of bonding energy may be used, including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy
Implementation Method 3
varying types of bonding energy may be used, including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy
Implementation Method 4
varying types of bonding energy may be used, including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy
Implementation Method 5
a tail of wire extending from the tip of a bonding tool (e.g., a capillary) is melted into a free air ball using a spark from an electronic flame-off (EFO) device
Data Source
AI summary
A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a).