Electronic Package Bonding Layer Vent for Soldering Pressure Buildup

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Solution Overview

Problem

The existing packaging methods for electronic devices, particularly optoelectronic devices, face damage during the soldering process due to pressure buildup from humidity turning into vapor, which can lead to structural modifications and unexpected damage locations.

Innovation Solution

A package design featuring a plate and lateral wall separated by a bonding material and a region made of a material that forms an opening between the inside and outside when heated, allowing for pressure relief during soldering, with the region located between the wall and plate, and the lateral wall made of resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the package is sealed tightly to protect the device, then the protection capability is improved, but pressure buildup during soldering causes damage to the package

Engineering Contradiction:

Improveprotection capabilityVSAvoidpressure buildup damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The bonding layer is segmented into two distinct regions: a first region that remains intact to maintain sealing, and a second region that forms an opening. This segmentation allows the bonding layer to simultaneously provide both sealing and pressure relief functions, resolving the contradiction between tight sealing and pressure release during soldering.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding layer are given different properties: the first region maintains strong bonding to ensure sealing, while the second region is designed to form an opening under heat. This local differentiation allows each region to perform its specific function optimally, enabling both protection and pressure relief.

Inventive Principle:

Principle #3Local quality

2Strength

If the package structure is made robust to prevent damage, then the strength is improved, but the soldering process still causes unexpected damage locations

Engineering Contradiction:

Improvestructural integrityVSAvoidunexpected damage locations

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The bonding layer is pre-configured with a second region that will form an opening under soldering heat. This preliminary design ensures that pressure relief occurs at the predetermined location before damage can propagate to other parts of the package, preventing unexpected damage locations while maintaining overall structural integrity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The soldering heat, which causes humidity expansion and pressure buildup, is converted into a beneficial effect by triggering the formation of the opening in the second region. This transforms the harmful thermal effect into a useful mechanism for pressure relief, preventing damage to the robust package structure.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Object-affected harmful factors

If a venting mechanism is added to relieve pressure, then the pressure relief capability is improved, but the package structure becomes more complex

Engineering Contradiction:

Improvepressure relief capabilityVSAvoidpackage structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The venting mechanism is merged with the bonding layer itself rather than being a separate component. The bonding layer's second region serves dual purposes: maintaining sealing in the first region and forming a vent in the second region under heat. This integration eliminates the need for additional venting components, maintaining structural simplicity while providing pressure relief capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bonding layer is designed to perform multiple functions: structural bonding, sealing, and pressure relief. By making the bonding layer multi-functional through the differentiated first and second regions, the patent avoids adding separate components for each function, thereby preventing an increase in overall package structure complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents damage to the package components by creating a venting mechanism that degases the cavity during soldering, maintaining the package's structural integrity and preventing unexpected damage.

Implementation Method 1

at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

a layer made of a bonding material and at least one region separating the plate and the wall

Methodology Applied

Scientific EffectBonding: Adhesive

Data Source

PatentUS11862757B2Electronic package

Publication Date: 2024.01.02 STMICROELECTRONICS (GRENOBLE 2) SAS

AI summary

The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.