Bonding Pad Circuit Layout for Position-Shifted Electronic Units

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Solution Overview

Problem

The manufacturing process of electronic devices often results in electrical reliability issues due to positional shifts of electronic units, causing abnormal electrical connections.

Innovation Solution

The method involves providing a bonding pad between two electronic units, surrounded by an insulating layer, and connecting them through a circuit layer to maintain electrical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electronic units are transferred on a carrier board before electrical connection, then the manufacturing process can be completed, but position shift occurs causing electrical reliability issues

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidposition accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a bonding pad as an intermediary component between electronic units that maintains electrical connection even when position shifts occur. The bonding pad acts as a mediator that absorbs positional deviations while ensuring continuous electrical contact between units.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent divides the electrical connection interface into separate functional elements: the bonding pad is segmented from the electronic unit body, allowing independent positioning and movement compensation. This segmentation enables the bonding pad to handle position shifts while the electronic unit maintains its functional integrity.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If position shift is allowed during manufacturing, then manufacturing flexibility increases, but electrical connection reliability deteriorates

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidelectrical connection reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The bonding pad serves as a flexible intermediary that accommodates position variations during manufacturing while maintaining reliable electrical connections. It provides manufacturing flexibility without compromising connection reliability by absorbing positional deviations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding pad structure is designed beforehand to accommodate potential position shifts. The extended bonding pad area creates a buffer zone that cushions against position deviations that may occur during subsequent manufacturing processes.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12408269B2Electronic device and method of forming electronic device

Publication Date: 2025.09.02 INNOLUX CORP

AI summary

An electronic device includes a first electronic unit, a second electronic unit, a bonding pad, an insulating layer and a circuit layer. The bonding pad is disposed between the first electronic unit and the second electronic unit. The insulating layer is disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad. The first electronic unit is electrically connected with the second electronic unit through the circuit layer and through the bonding pad.