Printed Circuit Aspects TRIZ Cases

Springs and latches replace solder balls in memory package-to-PCB connections, reducing reflow cracks and warping to improve reliability.

A radial PCB coupler uses annular strips and a coaxial conductor to transfer RF signals between layers with low loss and less board area.

A ramped interconnect replaces rough vertical vias, enabling controlled conductive ink deposition and stronger multilayer circuit connections.

A pre-assembled moving member and toggle button simplify PCIe connector release by removing precise alignment during circuit board mounting.

A one-piece molded circuit carrier integrates sensor, control, and conductor tracks to simplify smart plug connector assembly.

Closely spaced trace loops on a battery circuit board detect electrolyte leaks through conductivity changes, avoiding bulky sensors and limiting short-circuit risk.

A PCB-based winding layout moves the primary away from the air gap to cut eddy current losses and improve transformer consistency.

Separating unidirectional and bidirectional suppressor diodes across both PCB sides cuts footprint while preserving overvoltage protection.

Embedding block coil terminals in different resin layers prevents short circuits and displacement while core gaps improve power handling.

Relocating spacer positioning from the circuit board to a lower support member frees PCB area, improves layout flexibility, and cuts board size.

Resin-embedded terminals stabilize the block coil and reduce short-circuit risk, while core gaps delay saturation for higher power handling.

A one-piece molded circuit carrier integrates sensor and control functions in a plug connector to cut parts, simplify assembly, and avoid a separate sealing cover.

A layered flexible-board feed structure cuts coupling in compact transparent antennas while preserving electrical performance and appearance.

Different resin contents across coil component electrode layers improve adhesion and reduce stress while preserving conductivity in smaller parts.

A flexible PCB on the pouch terrace cuts pack thickness while a local molding portion conducts heat away from the protection element.

A thin flexible circuit board and thermally conductive molding shrink the protection module while maintaining heat dissipation and battery control.

A groove-mounted conductor links dual batteries with low impedance while freeing PCB area for other components and flexible placement.

Laser-cut grooves split closely spaced conductor patterns after photolithography, improving positioning accuracy and lowering capacitance.

Stacked ring resonators and via interconnects form a compact 3D filter that preserves low loss and passband flatness in millimeter-wave bands.

Predefined fold lines and in-mold film let touch electrodes follow 3D curved surfaces closely, improving sensitivity and product form.

Insulation over signal terminal ends and earlier ground contact redirect socket charge to ground, protecting chips and signal integrity.

A sacrificial first control channel detects water ingress while a protected backup channel keeps steering active long enough to reach a safe state.

A distribution cavity spreads coolant across jet nozzles to improve forced-convection heat removal in dense electronic hardware.

Flat vertical signal and reference traces with ground-plane cutouts help PCB transitions hold impedance and reduce reflections above 16 GT/s.

A flange and cantilever inner contact clamp a flexible substrate to connect conductors on either surface with stable retention and lower disconnection risk.

Offset primary and secondary spiral inductors to cut interwinding capacitance while preserving magnetic coupling and improving Q-factor.

An elastic inner contact and flange sandwich flexible substrates to connect front- or back-exposed conductors while resisting bend-related disconnection.

A stacked conductive layout uses a fine-pitch inner layer and through-connections to balance dense routing, reliable vias, and robust carrier build.

A compact inductor assembly uses side-by-side closed-core inductors and board openings to raise PCB density while reducing coupling.

A bonding pad between electronic units absorbs transfer misalignment and preserves stable circuit connections for higher electrical reliability.

Direct chip-to-board contact with a conducting medium cuts signal loss and lowers assembly temperature in compact camera modules.

A silicon carbide thermal bridge moves heat from PCB hotspots to cooler ground areas, lowering package temperature without harming electrical integrity.

Rounded transmission-element edges lower electric field peaks, enabling thinner insulation, lower thermal resistance, and less partial discharge risk.

Electromagnetic coils and magnets move the image sensor instead of the lens barrel, simplifying camera module assembly while enabling OIS, AF, and tilt correction.

Splitting outer lead wiring across two substrates with through-hole bridging preserves bonding while narrowing Mini LED frame width and splice joints.

A widened waveguide end and narrower intermediate section improve impedance matching, reflection, and high-frequency RF transmission.

A folded flexible substrate forms interleaved planar transformer windings without vias or stacked PCBs, cutting cost and leakage inductance.

Overlapping sensing pads with a power pattern cuts signal interference while improving electrical and bending reliability in dense display circuits.

Cutaway regions in a shared magnetic core reduce coupling between conductive paths, enabling compact high-current power circuits.

A dielectric buffer around conductive posts in glass through holes limits thermal-shock cracking and improves substrate yield and reliability.

Bus bars replace internal PCB power layers in a board connector, cutting layer count and thickness while preserving routing flexibility and reliability.

A protruding electrode through a passivation hole strengthens self-assembly alignment of micro LEDs, improving pad contact and display yield.

Oblique conductor protrusions anchor mounted components and buffer thermal expansion stress to reduce separation and improve module reliability.

Tapered columnar conductors in multilayer substrate through-holes enlarge the current path to cut resistance and high-frequency transmission loss.