Power Supply Module With Connection Pillars for Stable PCB Soldering
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Solution Overview
Problem
Conventional power supply modules experience poor welding and are not compatible with all circuit boards due to their weight and surface mounting design, leading to flattened welding spots and material waste.
Innovation Solution
A power supply module with metal connection pillars that protrude from its surface, allowing for stable electrical connections through openings or through holes in circuit boards, and a heat sink for improved heat dissipation, accommodating various circuit board structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If surface mounting manner is used to reduce power supply module size, then the power supply module size is reduced, but welding spots are flattened resulting in poor welding quality
Solution Approach 1:
The patent transitions from surface mounting (2D connection) to through-hole mounting (3D connection) by extending metal connection pillars through the entire power supply module body. This dimensional change allows the connection pillars to pass through the circuit board and be welded from both sides, avoiding the welding spot flattening issue while maintaining compact module size.
2Volume of moving object
If surface mounting manner is used, then power supply module size is reduced, but conventional circuit boards cannot be used requiring new circuit board designs
Solution Approach 1:
The patent makes the power supply module universally compatible with both conventional through-hole circuit boards and modern surface-mount circuit boards. The metal connection pillars can be welded through openings in SMT boards or through through-holes in conventional PCBs, allowing the same module design to work with multiple circuit board types without requiring dedicated board designs.
3Strength
If power supply module is heavily welded to circuit board, then connection strength is improved, but heat transfer to circuit board increases causing burning risk
Solution Approach 1:
The patent segments the heat transfer path by introducing thermal isolation structures between the power supply module and circuit board. The metal connection pillars are designed with thermal barriers or insulating materials at the welding interfaces, separating the mechanical connection function from the thermal conduction path. This allows strong mechanical bonding while blocking heat transfer to protect the circuit board from burning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances welding stability, reduces heat transfer to circuit boards, prevents material waste, and supports compatibility with different circuit board types, ensuring continuous and stable operation.
Implementation Method 1
heat is transmitted between the power supply module and the circuit board through the metal connection pillars and thermal radiation
Implementation Method 2
a heat sink for improved heat dissipation
Implementation Method 3
heat is transmitted between the power supply module and the circuit board through the metal connection pillars
Data Source
AI summary
A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.