Display Panel Outer Lead Layout for Narrow-Bezel Mini LED Splicing
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Solution Overview
Problem
Mini LED display panels require a relatively long outer lead bonding region, leading to a wide frame and large splice joints during splicing, which affects the display effect.
Innovation Solution
The display panel design divides the outer lead bonding region into two parts, with one part on the first substrate facing the light emitting direction for signal transmission and the other on the second substrate for bonding, using a through-hole and bridging wiring to connect them, allowing the first outer lead wiring to serve only as a signal transmission function, thereby narrowing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a relatively long outer lead bonding region is reserved on the edge of the mini LED display panel for bonding COF and PCB, then the bonding function is improved, but the frame width becomes wider
Solution Approach 1:
The patent divides the outer lead bonding region into two separate parts: a first outer lead wiring portion on the first substrate and a second outer lead wiring portion on the second substrate. This segmentation allows each portion to be optimized independently, with the first portion dedicated to signal transmission and the second portion dedicated to bonding, thereby reducing the overall frame width while maintaining bonding functionality.
Solution Approach 2:
The patent transitions from a planar bonding structure to a three-dimensional structure by using a through-hole portion that penetrates through the first substrate and second substrate, with a bridging wiring portion filling the through-hole. This dimensional change allows the outer lead wiring portions to be positioned on different substrates, reducing the frame width while maintaining electrical connection.
2Reliability
If a relatively long outer lead bonding region is reserved for bonding, then the bonding function is improved, but the splice joint size becomes larger during splicing
Solution Approach 1:
The patent segments the bonding function from the signal transmission function by placing the second outer lead wiring portion (for bonding) on the second substrate and the first outer lead wiring portion (for signal transmission) on the first substrate. This segmentation reduces the overlap area between bonding regions during splicing, thereby reducing the splice joint size while maintaining bonding reliability.
3Device complexity
If the first outer lead wiring serves both signal transmission and bonding functions, then the structure is simpler, but the frame width becomes wider
Solution Approach 1:
The patent divides the outer lead wiring into two separate portions with distinct functions: the first outer lead wiring portion on the first substrate is dedicated to signal transmission, while the second outer lead wiring portion on the second substrate is dedicated to bonding. This functional segmentation allows each portion to be optimized for its specific purpose, reducing the frame width while maintaining structural clarity.
Solution Approach 2:
The bridging wiring portion filling the through-hole serves as an intermediary that electrically connects the first outer lead wiring portion and the second outer lead wiring portion. This intermediary structure enables the separation of functions between the two outer lead wiring portions while maintaining electrical continuity, thereby reducing frame width without compromising functionality.
Data Source
AI summary
The present disclosure discloses a display panel and a method for preparing a display panel. The display panel includes a first substrate, a second substrate, a signal wiring portion, a first outer lead wiring portion, a second outer lead wiring portion, a through-hole portion, and a bridging wiring portion. The first outer lead wiring portion is disposed on a side surface of the first substrate along a light emitting direction of the display panel, and the second outer lead wiring portion is disposed on a side surface of the second substrate facing away from the first substrate and is electrically connected to the first outer lead wiring portion through the bridging wiring portion disposed in the through-hole portion.