Folded Planar Transformer Winding Without Vias or PCB Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional planar transformers face challenges with multiple turn windings requiring layer-to-layer vias or stacking separate PCBs, leading to increased costs and reliability issues.
Innovation Solution
A planar transformer winding assembly featuring a flexible substrate with conjoined annular rings and fold lines, allowing a primary winding on the upper surface and a secondary winding on the lower surface to be configured in different orientations, forming a single continuous structure that eliminates the need for layer-to-layer vias and separate connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If multiple turn windings are used in planar transformers, then the core size can be reduced, but layer-to-layer vias or stacking separate PCBs are required which increase cost and reliability issues
Solution Approach 1:
The patent transitions from planar 2D PCB layouts to a 3D folded structure where the flexible substrate is bent into multiple layers. This dimensional change allows multiple windings to be formed on a single continuous substrate without requiring vias or separate PCB stacks, effectively resolving the contradiction between achieving multiple turns and maintaining structural simplicity
Solution Approach 2:
The patent employs a flexible substrate that can be folded and bent to create multi-layer winding structures. This flexible film approach eliminates the rigidity constraints of traditional PCBs, allowing the substrate to form complex 3D winding patterns while maintaining electrical continuity without vias or additional connection layers
2Power
If traditional wire-wound transformers use multiple turn windings, then power density is improved, but the volume and weight are higher compared to planar transformers
Solution Approach 1:
The patent changes the physical configuration parameters of the winding structure by folding a single flexible substrate into multiple layers. This parameter change enables the achievement of multiple effective turns (improving power density) while maintaining the lightweight advantage of planar construction, as the same substrate material is reused in a folded geometry rather than adding more material
3Adaptability or versatility
If separate PCBs are stacked to create multiple windings, then winding flexibility is improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent merges multiple winding layers into a single continuous flexible substrate that is folded to create the multi-layer structure. This consolidation eliminates the need for separate PCBs and their associated alignment, stacking, and connection processes, thereby maintaining winding configuration flexibility while dramatically simplifying manufacturing and assembly
Data Source
AI summary
Embodiments of planar transformer winding assemblies are provided herein. For example, a transformer winding assembly comprises a primary winding configured to connect to an upper surface of a flexible substrate comprising a plurality of conjoined annular rings, the primary winding runs along the plurality of conjoined annular rings in a first configuration and a secondary winding configured to connect to a lower surface of the flexible substrate, the secondary winding runs along the plurality of conjoined annular rings in a second configuration different from the first configuration.