Display Circuit Layout With Overlapping Pads for Bending Reliability
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Solution Overview
Problem
The increasing number of signal lines and pads in electronic apparatuses leads to potential interference between electronic components and signal lines, affecting electrical reliability and bending reliability.
Innovation Solution
The electronic apparatus includes a base substrate with an active area and peripheral area, featuring power and sensing electrodes/pads that overlap, and a bending portion with specific circuit board connections to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of signal lines and pads is increased to support higher processing speed and data volume, then processing capability is improved, but the possibility of mutual interference between electronic components and signal lines increases
Solution Approach 1:
The patent transitions from planar arrangement of signal lines to a three-dimensional stacked architecture where signal lines are arranged in multiple layers. This vertical dimensionality change allows increased signal line density without increasing planar area, thereby supporting higher processing speed while maintaining electrical reliability through proper layer isolation and routing.
Solution Approach 2:
The patent divides the signal transmission path into multiple independent layers, with each layer containing specific signal lines. This segmentation isolates signals spatially, reducing mutual interference between adjacent signal lines while enabling higher density routing to support increased processing capability.
2Productivity
If signal lines are densely arranged to increase processing capability, then productivity is improved, but bending reliability deteriorates due to increased complexity and interference
Solution Approach 1:
By arranging signal lines in multiple stacked layers rather than dense planar configuration, the patent achieves high processing capability through vertical integration. This three-dimensional arrangement reduces mechanical stress concentration during bending operations, thereby maintaining bending reliability while supporting increased data processing capacity.
Solution Approach 2:
The patent employs flexible substrate structures that can accommodate bending stresses. The multi-layer signal line configuration on flexible substrates distributes mechanical stress more evenly during bending, preventing signal line damage while maintaining the high density required for increased processing capability.
Data Source
AI summary
An electronic apparatus includes a base substrate having an active area and a peripheral area adjacent to the active area. A plurality of pixels is disposed on the active area. The electronic apparatus also includes a plurality of power lines connected to the pixels. A power pad is disposed on a peripheral area and is configured to receive a power voltage. A power pattern is disposed on the peripheral area and connecting the power lines to the power pad. A plurality of sensing electrodes is disposed on the pixels in the active area. A plurality of sensing pads is disposed on the peripheral area and is electrically connected to the sensing electrodes. The sensing pads overlap with the power pattern.