PCB Tab Terminal Layout for Safe Socket Charge Discharge
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Solution Overview
Problem
The discharge path formed by socket, socket pin, signal terminal, and signal wire during semiconductor module mounting can damage internal circuits and deteriorate signal integrity due to charge accumulation in charged sockets.
Innovation Solution
Covering the end portion of signal terminals with insulation members before ground terminals contact the socket pins, ensuring charges are discharged through ground terminals, thereby preventing damage to semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the semiconductor module is mounted in a charged socket, then the mounting operation can be performed, but the accumulated charges in the socket may damage the semiconductor chip through the discharge path
Solution Approach 1:
The patent applies preliminary action by extending the ground terminal beyond the signal terminal, ensuring that the ground terminal makes contact with the socket pin before the signal terminal during the mounting operation. This pre-established ground connection provides a safe discharge path for accumulated charges before they can reach and damage the semiconductor chip, thus preventing damage while maintaining ease of mounting.
2Reliability
If the ground terminal is extended to contact the socket pin first, then charge discharge safety is improved, but the tab terminal structure becomes more complex
Solution Approach 1:
The patent applies universality by making the ground terminal serve multiple functions: it not only provides the essential ground connection function but also acts as a protective element that prevents charge discharge damage to the semiconductor chip. By extending the ground terminal to contact the socket pin first, it simultaneously establishes both the electrical ground reference and the safety discharge path, eliminating the need for separate protective structures.
3Reliability
If tie-bars are removed from tab terminals, then the discharge path is eliminated, but the manufacturing process becomes more complex due to the etch back process
Solution Approach 1:
The patent applies the taking out principle by selectively removing or not removing tie-bars based on their location and function. Tie-bars associated with ground terminals are retained to maintain the safe discharge path, while tie-bars on signal terminals may be removed. This selective approach eliminates harmful discharge paths to signal terminals while preserving the protective ground path, avoiding the need for complete etch back processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents circuit damage and signal integrity deterioration by redirecting charge discharge paths to ground, reducing manufacturing complexity and cost by omitting the etch back process for tie-bars.
Implementation Method 1
an end portion of each signal terminal may be covered by an insulation member
Data Source
AI summary
A semiconductor module includes a printed circuit board and a plurality of tab terminals on the printed circuit board. The plurality of tab terminals include a plurality of signal terminals and a plurality of ground terminals. The plurality of tab terminals are arranged in a first direction along a first edge of the printed circuit board, and each of the plurality of tab terminals extends in a second direction transverse to the first direction. Each of the plurality of signal terminals includes a first end portion adjacent to the first edge of the printed circuit board, and an insulation member on the printed circuit board. The insulation member includes an extension portion and a plurality of protruding portions. Each of the plurality of protruding portions covers the first end portion of a respective one of the plurality of signal terminals.