Connector Bus Bar Layout for Thinner Multi-Layer PCBs
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Solution Overview
Problem
The increase in the number of layers of a printed circuit board (PCB) for high-speed signal routing leads to increased manufacturing costs and reduced reliability, necessitating a reduction in the total number of layers and board thickness while maintaining signal integrity.
Innovation Solution
A connector assembly that omits the power supply layer from the circuit board by using bus bars to connect power supply pins and pads, allowing them to function as an alternative power supply layer, thereby reducing the number of layers and board thickness, and improving reliability and flexibility in wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of layers of a printed circuit board is increased for routing of high-speed signals, then the signal routing capability is improved, but the manufacturing cost increases and reliability is reduced
Solution Approach 1:
The patent extracts the power supply function from the internal PCB layers and relocates it to external bus bars mounted on the connector. This separation allows the PCB to have fewer layers dedicated to signal routing, thereby improving reliability while maintaining the necessary power distribution capability through the externally mounted bus bars.
Solution Approach 2:
The patent transitions the power supply structure from a two-dimensional layered arrangement within the PCB to a three-dimensional configuration using externally mounted bus bars. This dimensional change allows power distribution without requiring additional internal layers, thus reducing the total layer count and improving reliability while maintaining signal routing capability.
2Adaptability or versatility
If the number of layers of a printed circuit board is increased for routing of high-speed signals, then the signal routing capability is improved, but the board thickness increases
Solution Approach 1:
The patent extracts the power supply layers from the PCB stack-up and relocates them to external bus bars. This extraction eliminates the need for multiple internal power and ground layers, thereby reducing the overall board thickness while preserving high-speed signal routing capabilities in the remaining layers.
Solution Approach 2:
The patent moves the power supply function from the vertical stacking dimension (internal layers) to the external mounting dimension (bus bars on connector surfaces). This dimensional transition reduces the vertical thickness of the PCB while maintaining power distribution capability through the externally mounted structure.
3Use of energy by moving object
If power supply layers are included in the circuit board, then the power supply function is provided, but the total number of layers increases and board thickness increases
Solution Approach 1:
The patent extracts the power supply function from the internal PCB layers and implements it through external bus bars mounted on the connector assembly. This extraction allows the PCB to use fewer layers for power distribution, thereby reducing board thickness while maintaining the necessary power supply function through the externally mounted bus bar structure.
4Use of energy by moving object
If power supply layers are included in the circuit board, then the power supply function is provided, but the manufacturing cost increases
Solution Approach 1:
The patent extracts the power supply function from the complex multi-layer PCB structure and implements it through simpler external bus bars. This extraction reduces the number of PCB layers required, simplifying the manufacturing process and reducing manufacturing costs while maintaining the power supply function through the externally mounted bus bar assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, enhances reliability, and improves flexibility in routing other wirings by omitting the power supply layer, while maintaining effective power supply through bus bars, thus minimizing crosstalk and reducing the board's thickness.
Implementation Method 1
at least one bus bar, and the bus bar is connected to the one or plurality of power supply pins and is connected to the plurality of pads for power supply that are arranged spaced apart from each other in the second direction
Data Source
AI summary
Provided is a connector which is mounted on a circuit board and into which a module board of an external module is inserted in a first direction. The circuit board has pads for power supply that are arranged spaced apart from each other in a second direction, and the module board has electrodes for power supply. The connector includes: a connector body into which the module board is inserted; one or more power supply pins accommodated inside the connector body and being in contact with the electrodes for power supply of the module board; and at least one bus bar. The bus bar is connected to the one or more power supply pins and connected to the pads for power supply that are arranged spaced apart from each other in the second direction.