Orthogonal PCB Antenna Interface for Dual-Polarized Signal Routing
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Solution Overview
Problem
Existing phased array antennas face challenges in efficiently implementing dual-polarization using single PCBs, which leads to inefficiencies in signal transmission and reception, thermal management, and interference with electronic components.
Innovation Solution
A dual-polarized PCB array antenna with orthogonal interfaces between radiator substrates and PCBs, utilizing electrically conductive traces and pins to establish a shielded channel interface, enabling efficient dual-polarization without bulky connectors and facilitating thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single PCB is used to implement phased array antenna, then device complexity is reduced, but signal transmission efficiency and dual-polarization performance deteriorate
Solution Approach 1:
The invention divides the phased array antenna system into two separate PCBs: a first PCB for transmitting signals and a second PCB for receiving signals. This segmentation allows each PCB to be optimized for its specific function, improving signal transmission efficiency while maintaining manageable device complexity through modular architecture.
Solution Approach 2:
The invention transitions from a single-plane PCB architecture to a three-dimensional orthogonal arrangement where the first PCB and second PCB are positioned perpendicular to each other. This dimensional change enables dual-polarization functionality and improves signal transmission by separating transmit and receive paths in space, eliminating interference that would occur in a single-plane configuration.
2Reliability
If orthogonal interface with conductive pins is used, then signal transmission efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The invention combines multiple functions into the orthogonal interface structure: electrical connection (conductive pins), mechanical alignment (positioning features), and structural support (rigid connector design). This merging reduces the number of separate components and assembly steps, making the manufacturing process more efficient despite the complex orthogonal geometry.
Solution Approach 2:
The rigid connector serves as an intermediary component that bridges the first PCB and second PCB, providing a pre-fabricated orthogonal interface with integrated conductive pathways and positioning features. This intermediary component simplifies assembly by eliminating the need for complex field wiring and alignment procedures.
3Temperature
If large surface area PCB is used, then thermal management improves, but device size increases
Solution Approach 1:
The invention utilizes the third dimension (vertical space) by positioning the first PCB and second PCB orthogonally in three-dimensional space. This allows the system to achieve effective thermal management through vertical separation and independent heat dissipation paths without increasing the horizontal footprint, effectively trading vertical height for reduced planar area.
Data Source
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AI summary
A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.