Memory Package Spring-Latch PCB Connection Without Solder Balls
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Solution Overview
Problem
Reflow processes using solder balls to attach memory devices to printed circuit boards introduce thermal cycles that reduce the reliability of memory systems by causing cracks in solder joints and warping.
Innovation Solution
A connection system without solder balls, utilizing springs and latches to secure the package to the PCB, providing electrical and mechanical connections, which deform at lower temperatures and reduce warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used to attach memory devices to PCB, then electrical connection is achieved, but thermal cycles cause cracks in solder joints and reduce reliability
Solution Approach 1:
The patent removes solder balls from the attachment system entirely. Instead of using solder joints to connect the package to the PCB, the invention employs alternative attachment mechanisms that do not involve solder, thereby eliminating the source of thermal cycle-induced cracks and improving reliability.
Solution Approach 2:
The patent introduces an intermediary attachment mechanism between the package and PCB that does not rely on solder joints. This intermediary system absorbs or mitigates the harmful effects of thermal cycles, preventing crack formation while maintaining electrical and mechanical connections.
2Strength
If reflow processes are used with solder balls, then mechanical attachment is achieved, but warping occurs due to thermal cycles
Solution Approach 1:
The patent eliminates the reflow process and solder-based mechanical attachment. By removing the high-temperature soldering step, the invention prevents the thermal expansion and contraction cycles that cause warping, while still achieving secure mechanical attachment through alternative means.
Solution Approach 2:
The patent changes the attachment mechanism from a high-temperature soldering process to a low-temperature or room-temperature alternative. This parameter change in attachment temperature prevents thermal-induced warping while maintaining adequate mechanical strength for secure package attachment.
3Reliability
If solder balls are used for connection, then electrical connection is provided, but defects such as cracks and warping are introduced
Solution Approach 1:
The patent converts the harmful effect of eliminating solder balls (potential loss of connection stability) into a benefit by using alternative attachment mechanisms that actually improve reliability. The removal of solder joints, which are prone to cracking, is transformed into an advantage through the use of more robust attachment methods.
Solution Approach 2:
The patent introduces an intermediary attachment system that provides both mechanical support and electrical connection without the defects associated with solder joints. This intermediary mechanism ensures reliable connections while preventing the formation of cracks and warping defects during manufacturing and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the reliability of memory systems by minimizing defects such as cracks and warping during reflow processes.
Implementation Method 1
springs and latches to secure the package to the PCB, providing electrical and mechanical connections, which deform at lower temperatures and reduce warping
Data Source
AI summary
Methods, systems, and devices for connection designs for memory systems are described. A memory system may include a package and a printed circuit board (PCB). An interface of the package may be coupled with the PCB via a set of springs, where each spring may include a material configured to deform based at least in part on a shape of the package, a shape of the PCB, or both. The memory system may also include a set of latches that may secure the package in a fixed position relative to the PCB. That is, the set of springs may provide an electrical connection between the package and the PCB, and the set of latches may provide a mechanical connection between the package and the PCB. In some examples, the package, the PCB, or both, may include one or more connection structures configured to receive the latches.