Glass Circuit Substrate Through-Hole Buffering Against Microcracks
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Solution Overview
Problem
Existing glass packaging substrates face issues with reliability due to microcracks around through holes, which reduce yield and overall substrate performance.
Innovation Solution
Incorporating a dielectric layer and conductive post within the through hole of a glass substrate, with the dielectric layer acting as a buffer to prevent further crack formation during thermal shock, and using conductive posts with a higher modulus to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed in glass substrate for mounting conductive posts, then electrical connection is achieved, but microcracks occur around through holes reducing reliability
Solution Approach 1:
A dielectric layer is introduced as an intermediary material between the conductive post and the glass substrate. This dielectric layer fills the interface region around the through hole, acting as a buffer that prevents stress concentration and crack propagation at the critical glass-conductive post interface, thereby eliminating microcracks while maintaining electrical connection functionality
Solution Approach 2:
The dielectric layer is placed in advance around the conductive post within the through hole to provide preemptive stress relief. This cushioning layer prevents the formation of microcracks before they can occur during subsequent thermal cycling or mechanical loading, addressing the reliability issue proactively rather than reactively
2Reliability
If glass substrate is used for packaging, then thermal expansion matching and high-frequency performance are achieved, but manufacturing reliability cannot be effectively improved
Solution Approach 1:
The dielectric layer is nested within the through hole structure, surrounding the conductive post. This nested configuration allows the dielectric to provide stress relief and crack prevention functionality without adding external structural complexity, as the dielectric is integrated into the existing through hole geometry rather than requiring additional external components
Solution Approach 2:
The substrate structure becomes a composite system combining glass substrate, conductive post, and dielectric layer. This composite structure leverages the advantages of each material: glass provides thermal expansion matching and high-frequency performance, conductive post provides electrical connection, and dielectric provides stress relief, achieving improved manufacturing reliability through material composition rather than structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method effectively alleviates microcrack issues, improving the reliability and yield of glass substrate-based circuit substrates by preventing defects and enhancing thermal stability.
Implementation Method 1
the dielectric layer acting as a buffer to prevent further crack formation during thermal shock
Implementation Method 2
using conductive posts with a higher modulus to enhance structural integrity
Data Source
AI summary
A circuit substrate including a glass substrate, a conductive post, and a dielectric layer is provided. The glass substrate has a through hole, the conductive post is located in the through hole, and the dielectric layer is located in the through hole, wherein the conductive post is separated from the glass substrate by the dielectric layer.