Bonding Pad Wire Layout for ESD-Protected Light Unit Transfer
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Solution Overview
Problem
Electronic devices are vulnerable to damage from electrostatic discharge during the transfer of components, which can lead to production yield loss and device failure.
Innovation Solution
Incorporating electrostatic discharge protective units in the pick-and-place tool, carrier substrate, and object substrate to mitigate electrostatic discharge during the transfer of light emitting units, utilizing conductive metal wires, fixing layers, and switching elements to ground potential.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic discharge protective units are incorporated in the pick-and-place tool, carrier substrate, and object substrate, then device reliability is improved, but device complexity increases
Solution Approach 1:
Electrostatic discharge protective units are incorporated in advance into the pick-and-place tool, carrier substrate, and object substrate before the transfer process begins. This preliminary integration ensures that protection is already in place when components are transferred, preventing electrostatic discharge damage without requiring complex real-time monitoring or intervention systems.
Solution Approach 2:
The electrostatic discharge protective units act as intermediary elements between the pick-and-place tool, carrier substrate, and object substrate. These protective units intercept and dissipate electrostatic charges before they can damage sensitive light emitting units, serving as a mediating protection layer that simplifies the overall system design while maintaining high reliability.
2Reliability
If conductive metal wires and switching elements are used to ground potential, then protection against electrostatic discharge is improved, but manufacturing precision requirements increase
Solution Approach 1:
Conductive metal wires and switching elements are strategically positioned at specific locations where electrostatic discharge protection is most needed, such as at bonding pads and component contact points. This localized approach provides effective protection while reducing the overall complexity and precision requirements compared to a comprehensive grounding system.
Solution Approach 2:
The switching elements are designed to change their electrical parameters (resistance, conductivity) based on electrostatic charge levels. When electrostatic discharge is detected, the switching elements automatically adjust their conductivity to provide optimal grounding paths, allowing for effective protection with relaxed manufacturing tolerances through self-adjusting parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the impact of electrostatic discharge on light emitting units and substrates, enhancing production yield and device reliability by minimizing component damage.
Implementation Method 1
The conductive wire electrically connects the first electronic unit and the second electronic unit
Implementation Method 2
Incorporating electrostatic discharge protective units in the pick-and-place tool, carrier substrate, and object substrate to mitigate electrostatic discharge during the transfer of light emitting units
Data Source
AI summary
An electronic device includes a substrate, a first bonding pad, a second bonding pad, a first electronic unit, a second electronic unit and a conductive wire. The first bonding pad is disposed on the substrate. The second bonding pad is disposed on the substrate. The first electronic unit includes a first electrode bonding on the first bonding pad. The second electronic unit includes a second electrode bonding on the second bonding pad. The conductive wire electrically connects the first electronic unit and the second electronic unit. A size of the first electronic unit is different from a size of the second electronic unit.