3D Bonding Pad Structure for Close-Pitch Signal Isolation
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Solution Overview
Problem
Existing bonding pads in electronic devices face challenges when scaled down, as they can cause electron transfer between adjacent metal layers, leading to signal errors due to insufficient separation distance, which affects the reliability of the electronic devices.
Innovation Solution
The bonding pad structure incorporates a stereometric design with conductive layers having different distances from the substrate, ensuring a separation distance even when pads are arranged closely, reducing electron transfer by positioning at least part of one conductive layer between adjacent conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If bonding pads are arranged closely to reduce pitch, then productivity and area utilization are improved, but electron transfer between adjacent metal layers occurs causing signal errors
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of bonding pads to a three-dimensional stacked configuration with conductive layers at different heights. By positioning conductive layers of adjacent bonding pads at different vertical levels (first conductive layer at first height, second conductive layer at second height), the patent eliminates electron transfer while maintaining close horizontal spacing, thus resolving the contradiction between high density arrangement and signal integrity.
2Area of stationary object
If bonding pads are scaled down to reduce element size, then area utilization is improved, but separation distance between adjacent pads is reduced causing electron transfer
Solution Approach 1:
The patent utilizes the vertical dimension to create separation between conductive layers of adjacent bonding pads. Instead of relying solely on horizontal separation distance, the patent positions conductive layers at different heights (first height and second height), enabling compact substrate area utilization while maintaining adequate separation to prevent electron transfer.
Solution Approach 2:
The patent implements a nested structure where conductive layers are arranged in a stacked configuration with multiple levels. The first conductive layer and second conductive layer are positioned at different heights, creating a nested three-dimensional arrangement that maximizes space utilization while maintaining electrical isolation between adjacent bonding pads.
Data Source
AI summary
An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.