Printed Circuit Aspects TRIZ Cases

Repositioned bent signal terminals improve elastic PCB pin contact while preserving dense connector spacing and reducing crosstalk.

Shared through-hole conductive connections link optoelectronic elements to a driving board while increasing mounting density and lowering SMT cost.

A 90-degree symmetric terminal layout shortens and equalizes ring daisy chain links, cutting power use and improving memory chip communication rates.

A U-shaped split magnetic core and detector module improve current sensing accuracy and range while simplifying PCB-mounted assembly.

Control circuitry in the wound dressing detects liquid ingress or condensation and deactivates negative pressure to prevent electrical faults.

Electroplated post bumps on both PCB sides replace solder balls to support fine pitches, reduce warpage, and improve connection reliability.

A two-layer PCB spiral antenna shifts the ground plane to improve impedance matching, suppress resonance, and decouple adjacent antennas.

Integrated PCB-style wiring on a flat speaker membrane supports parallel coils, cutting routing complexity, vibration wear, and part count.

A formed metal sheet creates waveguide antennas and MMIC shielding on a PCB, cutting radar assembly cost while limiting loss and heat.

Exposed PCB edge conductive layers and side-mounted TIM create a lateral heat path for thick 3D storage packages in standard enclosures.

Using a soldered or press-fit pin as both conductor and terminal simplifies power resistor assembly and improves stability under thermal and mechanical loads.

A substrate groove and adjustable mold clamping contain resin leakage during insert molding, protecting terminals and preventing substrate damage.

A compliant locking member secures a board in a card edge connector while still allowing pivoting and skew to maintain stable connections.

Interrupted slit regions create stencil support points on the circuit board, improving solder print precision and reducing stencil deformation.

A layered flat-to-round cable layout removes the cable cover, simplifies coupling, and gives display housings a cleaner integrated appearance.

Mounting a reinforced flexible circuit around a cylindrical battery lowers pack height while improving heat dissipation and impact resistance.

Elastic projecting portions and a positioning rib secure the circuit board during soldering, avoiding screws and protective cover handling.

Ground-shielded DQ and DQS pin grouping cuts crosstalk in dense package layouts, enabling DDR5 links at 12.8 GT/s and above.

Different conductive-layer heights preserve separation in close-pitch bonding pads, reducing electron transfer and signal errors.

A branched flexible PCB places temperature sensors on both cell surfaces, improving placement accuracy while reducing connector count.

Thermal flattening of a coil base layer improves circuit-side flatness to 10-40 μm while preserving mechanical and electrical properties.

Expanding land pads with insulated outer ends let one board terminal layout mount different two-terminal component sizes with lower cost.

Tuned via pad and keepout dimensions match stripline impedance in multilayer PCBs, improving return loss and bandwidth without extra matching sections.