Coil Base Layer Thermal Flattening for Electrical Circuit Flatness
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Solution Overview
Problem
Conventional methods for producing electrical devices, such as those used in hard disk drives and sensors, face challenges in achieving the required flatness due to poor flatness of base materials, which affects the mechanical and electrical properties of the devices.
Innovation Solution
The method involves thermal flattening of a base layer with a coil set, followed by forming a dielectric and trace layers on the opposite side of the coil set, using a stainless steel or Cu alloy base layer and polyimide dielectric layer, and heating the base layer around a core at specific temperature ranges to improve flatness without degrading the materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to produce electrical devices with base materials having a coil set, then the manufacturing process is simple, but the flatness of the base layer deteriorates (poor flatness)
Solution Approach 1:
The patent applies preliminary action by performing thermal flattening on the base layer before forming the circuit patterns. This pre-treatment step removes coil set-induced distortions and establishes a flat surface, ensuring that subsequent circuit fabrication occurs on a uniformly flat substrate, thereby achieving the required flatness specification of 10μm to 40μm.
Solution Approach 2:
The patent utilizes parameter changes by controlling the thermal flattening process with specific parameters: heating temperature (300°C to 500°C), heating duration (20 to 200 minutes), and wrapping around a core with diameter (10 inch to 30 inch). These controlled parameter variations transform the base layer from a distorted state to a flat state without compromising material properties.
2Manufacturing precision
If thermal flattening is applied to improve flatness, then manufacturing precision improves, but energy consumption increases
Solution Approach 1:
The patent optimizes energy consumption by carefully selecting and controlling thermal flattening parameters. The temperature range (300°C to 500°C) and duration (20 to 200 minutes) are specifically chosen to achieve the required flatness while minimizing unnecessary energy input. The relationship between temperature, time, and resulting flatness is controlled to achieve the minimum effective energy input for the desired outcome.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the flatness of electrical devices from 60 μm to 100 μm to 10 μm to 40 μm, maintaining mechanical and electrical properties, and consistently meeting flatness specifications, with improved average flatness across the device.
Implementation Method 1
thermal flattening the base layer... heating the base layer at 300° C. to 500° C.... the heating the base layer is performed for 20 to 200 minutes
Implementation Method 2
the thermal flattening of the base layer includes wrapping the base layer around a core against the coil set
Data Source
AI summary
An improved method for manufacturing an electrical device is described herein. In some embodiments according to the present disclosure, the method includes: providing a base layer with a coil set, thermal flattening the base layer, and forming a circuit on the base layer opposite of the coil set in the base layer.