Formed Waveguide Antennas With PCB Shielding and Lower-Cost Assembly

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Solution Overview

Problem

Radar systems for automotive applications face challenges with high manufacturing costs and performance issues due to the use of expensive materials that can withstand high temperatures, such as polyetherimide with metal coatings, which are required for bonding processes.

Innovation Solution

The implementation of a radar system with a printed circuit board (PCB) and a metal sheet forming waveguide antennas, including multiple waveguide channels and radiation slots, where the metal sheet also serves as a shield for a monolithic microwave integrated circuit (MMIC) and thermally conductive material covers the PCB surfaces to distribute thermal energy effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plastic-molded technology with metallic coatings is used to construct radar systems, then the structural integrity and shielding performance are improved, but the manufacturing cost increases due to expensive high-temperature resistant plastics

Engineering Contradiction:
Improvestructural integrityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive high-temperature resistant plastics with a disposable metal foil layer that is bonded to the PCB. The metal foil serves the same structural and shielding functions at a fraction of the cost, eliminating the need for costly plastic materials while maintaining reliability.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameter from plastic to metal foil, and changes the bonding process from high-temperature bonding to low-temperature adhesive bonding. This parameter change allows the use of cheaper materials while maintaining the required structural integrity and shielding performance.

Inventive Principle:
Principle #35Parameter changes

2Strength

If high-temperature bonding processes are used to bond metal-coated plastic layers, then the bonding strength is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvebonding strengthVSAvoidmanufacturing process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent changes the bonding temperature parameter from high-temperature to low-temperature processing. By using adhesive bonding at lower temperatures, the manufacturing process complexity is reduced while maintaining adequate bonding strength for the radar system assembly.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a disposable metal foil layer that simplifies the bonding process. The foil can be bonded using simpler, lower-cost methods compared to bonding metal-coated plastic layers, thereby reducing manufacturing process complexity while maintaining assembly integrity.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If metal-coated plastic layers are bonded together, then the shielding performance is improved, but the number of assembly steps increases

Engineering Contradiction:
Improveshielding performanceVSAvoidassembly speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges the shielding function and structural function into a single metal foil layer bonded to the PCB. This eliminates the need for multiple metal-coated plastic layers, reducing the number of assembly steps while maintaining shielding performance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal foil layer serves multiple functions simultaneously: it provides electromagnetic shielding, structural support, and thermal management. This multi-functionality reduces the number of components and assembly steps required, thereby improving productivity without compromising shielding performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs while maintaining high performance by minimizing signal loss and enabling better thermal management, allowing for fewer assembly steps and improved radar system performance.

Implementation Method 1

a thermally conductive material covering at least a portion of a first and a second surface of the PCB

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The metal sheet can be formed to provide one or more waveguide antennas that each include multiple waveguide channels

Methodology Applied
Scientific EffectWaveguide propagation: Waveguide

Implementation Method 3

Multiple radiation slots can be formed on a surface of each of the multiple waveguide channels

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Implementation Method 4

The metal sheet can also be formed to provide a shield for the MMIC

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12058804B2Formed waveguide antennas of a radar assembly
Publication Date: 2024.08.06 APTIV TECHNOLOGIES AG
  • US12058804B2 patent drawing
  • US12058804B2 patent drawing
  • US12058804B2 patent drawing

AI summary

Formed waveguide antennas using one or metal sheets can improve the materials and manufacturing process of a radar assembly. For example, the radar system can include a printed circuit board (PCB) and a metal sheet attached to the PCB. The metal sheet can be formed to provide multiple waveguide antennas that each include multiple waveguide channels. Multiple radiation slots can be formed on a surface of each of the multiple waveguide channels. The PCB can include an MIMIC and a thermally conductive material covering a portion of a first and a second surface of the PCB. The metal sheet can also be formed to provide a shield for the MIMIC. In this way, the described techniques and systems permit the waveguide antennas to formed with materials and a manufacturing process that reduce costs while still providing high performance (e.g., minimized loss).