Optoelectronic Mounting Structure With Shared Through-Hole Connections
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Solution Overview
Problem
Conventional surface mount technology (SMT) limits component density and increases manufacturing costs due to the need for multiple through holes and conductive members, which can be costly and inefficient in connecting optoelectronic elements to driving circuit boards.
Innovation Solution
The proposed electronic device and manufacturing method utilize a substrate with through holes located internally, allowing for reduced numbers of conductive members and shared through holes among optoelectronic elements, connected via conductive members made from materials like solder or copper paste, to enhance component density and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface mount technology is used with multiple through holes and conductive members for each component, then reliable electrical connections are achieved, but component density is limited and manufacturing costs increase
Solution Approach 1:
The patent merges multiple through holes into a single shared through hole that serves multiple optoelectronic elements. Instead of having separate through holes for each component, the invention uses one through hole with a conductive member that provides electrical connection to multiple elements, thereby increasing component density while maintaining connection reliability
Solution Approach 2:
The conductive member in the shared through hole performs multiple functions: it provides electrical connection to multiple optoelectronic elements simultaneously, serves as a mounting structure, and eliminates the need for separate connection paths for each component. This multi-functionality resolves the contradiction by reducing the number of through holes needed
2Reliability
If conventional surface mount technology uses multiple through holes and conductive members per component, then adequate electrical connections are established, but manufacturing costs increase
Solution Approach 1:
By combining multiple through holes into a single shared through hole, the invention reduces the total number of conductive members required. This merging approach lowers material costs and simplifies the manufacturing process while maintaining adequate electrical connections to all optoelectronic elements
Solution Approach 2:
The invention creates a reusable shared through hole structure that can serve multiple components. Instead of manufacturing separate through holes for each element, the same through hole structure is effectively copied in its functionality across multiple elements, reducing overall manufacturing complexity and cost
3Reliability
If multiple through holes and conductive members are used for each surface mount component, then proper electrical connections are achieved, but the number of components per area is reduced
Solution Approach 1:
The patent merges the spatial footprint of multiple through holes into a single shared through hole location. This consolidation dramatically reduces the area occupied by connection structures, allowing more components to be packed into the same area while maintaining reliable electrical connections through the shared conductive member
Solution Approach 2:
The invention transitions from a distributed arrangement of multiple through holes across different locations to a centralized shared through hole structure. This dimensional reorganization allows multiple elements to share the same spatial location for their connection point, freeing up board area for additional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases component density and decreases manufacturing costs by optimizing the placement and usage of through holes and conductive members, enabling more efficient electrical connections while maintaining the same number of optoelectronic elements.
Implementation Method 1
The at least two conductive members disposed in the at least two through holes electrically connect the at least two signal lines of each of the surface mounting structures to the at least two connection pads of each of the connection pad groups of the driving circuit board
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.