Image Sensor Package Substrate Groove for Resin Leakage Control
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Solution Overview
Problem
Existing sensor package manufacturing methods face challenges with resin leakage and damage to components during insert molding due to thickness tolerance variations in the mounting substrate, leading to adhesion issues with components and terminals, and potential damage from metal molds.
Innovation Solution
The implementation of a sensor package configuration that includes an etch-back region and a groove to manage resin leakage, preventing adhesion to wire bonding terminals and ensuring stable molding by adjusting the metal molds to accommodate thickness variations, while using anaerobic resin for secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If insert molding is used to mold a frame to a substrate, then the frame can be firmly connected with the substrate, but resin leakage may occur when substrate thickness varies, causing resin to adhere to components and terminals
Solution Approach 1:
The clamp part of the metal mold is divided into a first clamp part and a second clamp part positioned at different locations. This segmentation allows independent adjustment of clamping positions to accommodate substrate thickness variations without causing resin leakage onto components and terminals
Solution Approach 2:
The invention allows changing the clamping position parameters by adjusting the positions of the first and second clamp parts. This enables adaptation to different substrate thicknesses while maintaining proper resin flow control and preventing harmful adhesion to sensitive components
2Ease of manufacture
If the metal molds clamp the substrate to mold the frame, then the frame molding can be performed, but the substrate may be damaged when thickness exceeds nominal size
Solution Approach 1:
The metal mold clamp parts are designed to be adjustable in position rather than fixed. This dynamic adjustment capability allows the clamping force to be applied at optimal locations that accommodate substrate thickness variations, preventing damage to thicker substrates while maintaining effective frame molding
Solution Approach 2:
The clamp parts are positioned in advance at locations that prevent substrate damage before the molding process begins. This preliminary positioning ensures that even substrates with greater than nominal thickness will not be damaged during clamping and molding operations
3Productivity
If the clamp part is positioned close to the substrate edge for effective clamping, then frame molding is improved, but resin leakage adheres to wire bonding terminals
Solution Approach 1:
The clamping function is segmented into multiple clamp parts at different positions. The first clamp part can be positioned for effective clamping while the second clamp part is positioned to control resin flow, preventing adhesion to wire bonding terminals while maintaining molding efficiency
Solution Approach 2:
The second clamp part acts as an intermediary element that controls resin flow behavior. By positioning this clamp part appropriately, resin flow is mediated and directed away from sensitive areas like wire bonding terminals, even when the first clamp part is positioned for optimal clamping efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents resin adhesion to sensitive areas, ensures stable frame molding, and reduces manufacturing costs by allowing for broader thickness tolerance ranges, enhancing the yield and reliability of the sensor package.
Implementation Method 1
molds a frame to a substrate by insert molding. The insert molding is a technique that molds a frame by clamping upper and lower sides of a substrate with metal molds and injecting resin into a cavity of the metal molds that is formed along a periphery of the substrate
Implementation Method 2
using anaerobic resin for secure bonding
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.